Abstract: A tool which is particularly useful in sealing plastic materials used in constructing model airplanes or for soldering is disclosed. The tool includes a handle containing a full wave AC control and heating shoe containing first and second bores. A sleeve has one end detachably connected to the handle and has inserted in its other end a cylindrical heating cartridge. The heating cartridge and sleeve are inserted into the bores in the heating shoe and held in place by means of a a set screw. The sleeve has an enlarged collar portion which engages the end of the heating shoe. An insulating collar of polytetrafluoroethylene surrounds the portion of the sleeve extending from the collar portion to the handle and minimizes heat transfer from the heating shoe and sleeve to the handle. The external surface of the heating shoe may be provided with a non-stick coating. The heating cartridge is connected to the AC line through the control in the handle to permit controlling degree of heat.