Patents by Inventor Paul V. Pesavento

Paul V. Pesavento has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898264
    Abstract: Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: February 13, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Collin M. Grove, Douglas P. Riemer
  • Publication number: 20220351893
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Application
    Filed: July 11, 2022
    Publication date: November 3, 2022
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Patent number: 11387033
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: July 12, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Patent number: 11285631
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: March 29, 2022
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Publication number: 20220090284
    Abstract: Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 24, 2022
    Inventors: Paul V. Pesavento, Collin M. Grove, Douglas P. Riemer
  • Publication number: 20220074067
    Abstract: A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventors: Paul V. Pesavento, Douglas P. Riemer, David A. Brouchous
  • Patent number: 11020108
    Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 1, 2021
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Patent number: 10925663
    Abstract: An apparatus and related methods are described. The apparatus is described that includes a structural metal element including a metallic foam layer. The apparatus also includes a second metal element and a nonmetallic spacer. The nonmetallic spacer arranged between the structural metal element and the second metal element, the metallic foam layer joined to the nonmetallic spacer.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 23, 2021
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20210017093
    Abstract: A method to fuse ceramic to a metallic substrate is provided. The method includes dispensing a ceramic material onto the metallic substrate and firing of the ceramic material to the metallic substrate at a predetermined temperature. The firing of the ceramic material promotes adhesion between the ceramic material and the metallic substrate.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 21, 2021
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis
  • Publication number: 20200180180
    Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.
    Type: Application
    Filed: February 14, 2020
    Publication date: June 11, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Publication number: 20200139567
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 7, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Patent number: 10625083
    Abstract: A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: April 21, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20200090852
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Publication number: 20200045831
    Abstract: A method of plating a conductive material includes providing conductive material. An aqueous bath solution comprised of at least one solvent, a nickel source, a phosphorous source, a reducing agent, a pH-controlling material, a stabilizer and a complexing agent is used to plate the conductive material. The conductive material contacts the bath solution. Electroless plating occurs on top of the conductive material and the plating includes from about 88 to 93 wt. % nickel and from at least 7 to about 12 wt. % phosphorous to form a nickel-phosphorous plating. The thickness of the plating is from about 50 to about 300 nm and the plating is generally uniform with the thickness of the surface being within 20 percent of the average thickness across the surface of the plating.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 6, 2020
    Inventors: Paul V. Pesavento, Douglas P. Riemer, Michael E. Roen
  • Publication number: 20200023534
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Patent number: 10500748
    Abstract: A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: December 10, 2019
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Patent number: 10478984
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: November 19, 2019
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Publication number: 20190083166
    Abstract: An apparatus and related methods are described. The apparatus is described that includes a structural metal element including a metallic foam layer. The apparatus also includes a second metal element and a nonmetallic spacer. The nonmetallic spacer arranged between the structural metal element and the second metal element, the metallic foam layer joined to the nonmetallic spacer.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 21, 2019
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento
  • Publication number: 20180104837
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: December 18, 2017
    Publication date: April 19, 2018
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Publication number: 20170368357
    Abstract: A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 28, 2017
    Inventors: Michael W. Davis, Douglas P. Riemer, Clark T. Olsen, Steven R. Lagergren, Paul V. Pesavento