Patents by Inventor Paul W. Browne

Paul W. Browne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
    Patent number: 8828750
    Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: September 9, 2014
    Assignee: Xerox Corporation
    Inventors: Peter J Nystrom, Peter M Gulvin, Paul W Browne
  • Highly Integrated Wafer Bonded MEMS Devices with Release-Free Membrane Manufacture for High Density Print Heads
    Publication number: 20130241999
    Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component.
    Type: Application
    Filed: May 1, 2013
    Publication date: September 19, 2013
    Applicant: Xerox Corporation
    Inventors: Peter J. Nystrom, Peter M. Gulvin, Paul W. Browne
  • Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
    Patent number: 8455271
    Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: June 4, 2013
    Assignee: Xerox Corporation
    Inventors: Peter J. Nystrom, Peter M. Gulvin, Paul W. Browne
  • HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS
    Publication number: 20080238997
    Abstract: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Peter J. Nystrom, Peter M. Gulvin, Paul W. Browne
  • Electrical detection of V-groove width
    Patent number: 6558974
    Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: May 6, 2003
    Assignee: Xerox Corporation
    Inventors: Paul A. Hosier, Paul W. Browne, Scott L. TeWinkle
  • Electrical detection of V-groove width
    Publication number: 20020079918
    Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.
    Type: Application
    Filed: October 29, 2001
    Publication date: June 27, 2002
    Applicant: Xerox Corporation
    Inventors: Paul A. Hosier, Paul W. Browne, Scott L. TeWinkle
  • APPARATUS FOR DETECTING THE WIDTH OF A V-GROOVE FORMED IN A SEMICONDUCTOR WAFER
    Publication number: 20020074545
    Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.
    Type: Application
    Filed: December 14, 2000
    Publication date: June 20, 2002
    Applicant: Xerox Corporation
    Inventors: Paul A. Hosier, Paul W. Browne, Scott L. TeWinkle
  • Electrical detection of V-groove width
    Patent number: 6396297
    Abstract: An apparatus detects the width of a V-groove formed on a semiconductor wafer. A resistor overlaps a chip area and an area upon which the V-groove is to be etched on the wafer. A pad etched on the silicon wafer is coupled to the resistor. A tester supplies voltage to the pad after the V-groove has been etched into the silicon wafer; and a circuit coupled to the pad determines the width of the etched V-groove.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: May 28, 2002
    Assignee: Xerox Corporation
    Inventors: Paul A. Hosier, Paul W. Browne, Scott L. TeWinkle
  • Electrical detection of V-groove width
    Patent number: 6342403
    Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: January 29, 2002
    Assignee: Xerox Corporation
    Inventors: Paul A. Hosier, Paul W. Browne, Scott L. TeWinkle
  • System for combining data from multiple CPU write requests via buffers and using read-modify-write operation to write the combined data to the memory
    Patent number: 5459842
    Abstract: A write compression buffer is connected to a CPU bus and to a memory controller to provide write cycle compression in which plural partial write requests to the same memory address are compressed into a single memory write cycle. The buffer has a plurality of buffering level.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: October 17, 1995
    Assignee: International Business Machines Corporation
    Inventors: Ralph M. Begun, Paul W. Browne, Marc R. Faucher, Gerald L. Frank, Christopher M. Herring