Patents by Inventor Paul W. Churilla

Paul W. Churilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly having an indium thermal couple
    Patent number: 6882043
    Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: April 19, 2005
    Assignee: Intel Corporation
    Inventors: Terrance J. Dishongh, Paul W. Churilla, David H. Pullen
  • Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
    Publication number: 20020151110
    Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
    Type: Application
    Filed: June 4, 2002
    Publication date: October 17, 2002
    Applicant: Intel Corporation
    Inventors: Terrance J. Dishongh, Paul W. Churilla, David H. Pullen
  • Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
    Patent number: 6461891
    Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: October 8, 2002
    Assignee: Intel Corporation
    Inventors: Terrance J. Dishongh, Paul W. Churilla, David H. Pullen
  • METHOD OF CONSTRUCTING AN ELECTRONIC ASSEMBLY HAVING AN INDIUM THERMAL COUPLE AND AN ELECTRONIC ASSEMBLY HAVING AN INDIUM THERMAL COUPLE
    Publication number: 20020020912
    Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
    Type: Application
    Filed: September 13, 1999
    Publication date: February 21, 2002
    Inventors: TERRANCE J. DISHONGH, PAUL W. CHURILLA, DAVID H. PULLEN