Abstract: Disclosed is a semiconductor body mounted on an electrically-insulative, thermally-conductive plate which also carries metallized contacts electrically connected to the various contact areas associated with the semiconductor body. A protective one-piece insulative bridge overlies the semiconductor body and includes legs secured to the plate and a cross member extending over the body. The bridge facilitates pressing or clamping the plate in enhanced heat-transferring relation to a substrate heatsink without application of any pressure on the body or other deleterious effects to the body.

Abstract: Disclosed is an isolated semiconductor assembly with a pellet mounting plate having a beveled periphery and surmounted by a semiconductor pellet. A ribbon-shaped lead overhangs the edge of the top of the pellet and terminates in the plane of the lower side of the mounting plate. A ceramic substrate has conductive leads bonded thereto, portions of which are in registry with and bonded to the plate and ribbon-shaped lead. External connections can be made to other areas of the conductive leads.

Abstract: Disclosed is an assembly with a semiconductor pellet mounting plate that defines two substantially parallel major surfaces, at least one surface having a central planar region surrounded by a smaller peripheral transition region such that the periphery of the major surface is recessed and out of the plane of the central planar region. A semiconductor pellet is mounted on the central planar region and the metallic contacts on the pellet are substantially coextensive with the central planar region. The peripheral transition region can take any of several disclosed forms.