Abstract: Disclosed are methods and devices relating to microelectromechanical systems (MEMS). A method for fabricating a mechanical beam in a microelectromechanical (MEM) device may comprise depositing a masking layer on a first side of a substrate; etching a first notch on the first side of the substrate; forming a beam structure on the substrate, wherein a first portion of the beam structure is coupled to the first notch; etching a second notch at a second portion of the beam structure; depositing an oxide layer on the beam structure, the masking layer, and the substrate; etching a horizontal surface of the oxide layer at the masking layer and the substrate; and releasing the mechanical beam from the substrate, wherein the mechanical beam comprises the beam structure, the oxide layer, and the masking layer.

Abstract: A method for fabricating semiconductor wafers as multiple-depth structure (i.e., having portions of varying height). The method includes patterning a first substrate and bonding a second substrate to the first. This process creates a subsurface patterned layer. Portions of the second substrate may then be etched, exposing the subsurface patterned layer for selective processing. For example, the layered structure may then be repeatedly etched to produce a multiple depth structure. Or, for example, exposed portions of the first substrate may have material added to them to create multiple-depth structures. This method of fabrication provides substantial advantages over previous methods.