Abstract: A wafer-type lockset that employs wafer assemblies and locking keys to adjustably key the lockset. The wafer assemblies include a base wafer and a re-settable wafer that may be adjustably coupled to the base wafer. The locking keys are movable between a first position, in which the base and re-settable wafers are coupled to one another, and a second position, in which the base and re-settable wafers are uncoupled from one another. A key having a desired key profile may be employed to set or program the lockset. A method for re-keying a lockset is also provided.

Abstract: Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.