Abstract: One or more structures and/or methods are provided. In an example of the subject matter presented herein, an apparatus includes a circuit board, a first component mounted to the circuit board, a shielding structure mounted to the circuit board and having a first platform elevated over the circuit board, and a semiconductor die mounted to the first platform, wherein the shielding structure is between the first component and the semiconductor die.

Abstract: A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.

Abstract: Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

Abstract: Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

Abstract: A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.

Abstract: A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.

Abstract: A gas detector comprising a sensor (100) configured to detect the oxygen content in the ambient air around the gas detector; a housing configured to seal around a portion of the sensor, creating a hermetically sealed interior of the housing while exposing at least a portion of the sensor on the exterior of the housing; and a pressure equalizing element (112, 114) located between the exposed portion of the sensor and the hermetically sealed interior of the housing, configured to allow pressure equalization of the sealed interior of the housing.

Abstract: Various example embodiments described herein relate to an electrochemical gas sensor. The electrochemical gas sensor can include a sensor cap having one or more solid features disposed on a surface of the sensor cap. The electrochemical gas sensor can include a counter electrode configured to generate a gas during use of the electrochemical gas sensor. The electrochemical gas sensor can include a vent assembly adapted to release at least a portion of the gas generated at the counter electrode out from the electrochemical gas sensor. The vent assembly can include a vent conduit and a vent membrane that defines a passage for the gas to flow from an extended portion of the counter electrode, to the vent conduit, via the vent membrane, so as to be vented from the electrochemical gas sensor.

Abstract: A gas detector comprising a sensor (100) configured to detect the oxygen content in the ambient air around the gas detector; a housing configured to seal around a portion of the sensor, creating a hermetically sealed interior of the housing while exposing at least a portion of the sensor on the exterior of the housing; and a pressure equalizing element (112, 114) located between the exposed portion of the sensor and the hermetically sealed interior of the housing, configured to allow pressure equalization of the sealed interior of the housing.

Abstract: A gas sensor is disclosed. The gas sensor includes a gas sensing electrode and a counter electrode disposed within a housing, and respective conductors that connects the gas sensing electrode and the counter electrode to a sensing circuit. The housing includes walls defining a cavity containing electrolyte in fluid communication with the gas sensing electrode and counter electrode and wherein the walls further comprise one or more coatings or second layers superimposed on the walls. The one or more coatings or second layers have a lower water vapor transport rate than that of the walls, such that, in use, water vapor transport between the electrolyte and atmosphere through the walls of the housing is reduced.

Abstract: A gas sensor is disclosed. The gas sensor includes a gas sensing electrode and a counter electrode disposed within a housing, and respective conductors that connects the gas sensing electrode and the counter electrode to a sensing circuit. The housing includes walls defining a cavity containing electrolyte in fluid communication with the gas sensing electrode and counter electrode and wherein the walls further comprise one or more coatings or second layers superimposed on the walls. The one or more coatings or second layers have a lower water vapor transport rate than that of the walls, such that, in use, water vapor transport between the electrolyte and atmosphere through the walls of the housing is reduced.

Abstract: A three-dimensional circuit substrate comprises one or more electrically conductive tracks. The substrate is formed from a unitary moulding over the one or more electrically conductive tracks and thereby provides structural support therefor.

Abstract: A method of forming an electrical circuit for an electrical component comprises the steps of; producing an electrical circuit from a planar conductive material, the circuit including tracks and tie bars between tracks; over-moulding the electrical circuit ith plastics material leaving tie bars in apertures; and removing the tie bars after the over-moulding process.