Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within a housing adaptable for use in an electronic device.

Abstract: A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.

Abstract: Methods of depositing thin film materials having crystalline content are provided. The methods use plasma enhanced chemical vapor deposition. According to one embodiment of the present invention, microcrystalline silicon films are obtained. According to a second embodiment of the present invention, crystalline films of zinc oxide are obtained. According to a third embodiment of the present invention, crystalline films of iron oxide are obtained.

Abstract: A biometric sensor and button assembly and method of making same are disclosed which may comprise: a button housing comprising at least two side walls each forming a vertical load absorbing tower and defining an opening within the button housing; an insert within the opening within the housing; a sensor controller integrated circuit positioned within a cavity formed in one of the insert, the housing or a combination of the insert and the housing; and the insert and the housing cooperating to absorb vertical loading on the button housing, thereby protecting the integrated circuit from excess vertical loading. The assembly and method may also comprise the biometric comprising a fingerprint sensed by the biometric sensor. The assembly and method may also comprise the at least two side walls comprising at least four side walls, the cavity being formed within the bottom of the insert, within the housing, or both.

Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multilayer laminate package.

Abstract: A method and system is disclosed which may comprise a biometric object sensor that may comprise at least one conductive layer formed from a transparent or translucent material and formed in at least one of on, in or under an outer layer of a user device housing; at least one of a transmitter trace and at least one of a receiver trace formed from the at least one of the transparent or translucent material in the conductive layer. The transparent or translucent material may form at least a portion of a touch screen display on a user device. The at least one of a transmitter trace and at least one of a receiver trace may comprise one of a plurality of transmitter traces and a receiver trace and a plurality of receiver traces and a transmitter trace or a plurality of transmitter traces and a plurality of receiver traces.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within a housing adaptable for use in an electronic device.

Abstract: Methods of depositing thin film materials having crystalline content are provided. The methods use plasma enhanced chemical vapor deposition. According to one embodiment of the present invention, microcrystalline silicon films are obtained. According to a second embodiment of the present invention, crystalline films of zinc oxide are obtained. According to a third embodiment of the present invention, crystalline films of iron oxide are obtained.

Abstract: A sensing circuit and method is disclosed, which may comprise a plurality of transmitting or receiving elements each defining a pixel location defined by a gap between the respective one of the plurality of transmitting or receiving elements and a single element of the opposing type to the respective transmitting or receiving element, and a controller configured to provide or receive a probing signal to or from a group of at least two of the plurality of transmitting or receiving elements, at the same time, thereby increasing the effective area providing the transmitting of or the receiving of the probing signal for each pixel location imaged. The group of transmitting or receiving elements may form a symmetric pattern, which may be centered on the pixel location. The plurality of transmitting or receiving elements may form at least one linear pixel array with the respective single receiving or transmitting element.

Abstract: The disclosure is directed to electronic device displays which are constructed to withstand damage from an impact resistance test wherein a steel ball of 2 g having a diameter of 8 mm is dropped from a designated height greater than 1 ft, more preferably greater than 2 ft, even more preferably greater than 3 ft, still even more preferably greater than 4 ft, yet even more preferably greater than 5 ft and even more preferably greater than 6 ft. The displays are configured using, for example, ultrathin glass adhered to a base glass, wherein the adhesive layer is optimized for thinness and stiffness.

Abstract: Electronic devices are described which are adapted and configured to incorporate a fingerprint sensor within a recess or aperture, formed or molded in the housing, such that the fingerprint sensor interface is within 500 microns of an exterior surface of the device. Methods of use and manufacture are also described.

Abstract: Methods of depositing thin film materials having crystalline content are provided. The methods use plasma enhanced chemical vapor deposition. According to one embodiment of the present invention, microcrystalline silicon films are obtained. According to a second embodiment of the present invention, crystalline films of zinc oxide are obtained. According to a third embodiment of the present invention, crystalline films of iron oxide are obtained.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: The manufacturing methodology to produce polycrystalline silicon in time and cost efficient manner uses a spatially selective crystallization approach to greatly reduce the amount of energy delivered to the work surface. The amorphous silicon film is subjected to laser radiation substantially exclusively at localized areas where TFTs are to be formed. The source of radiation is a copper vapor laser which produces a highly stable radiation in a visible spectrum with an energy sufficient to convert amorphous silicon into polysilicon in 1-3 shots. The optic system delivers the homogenized, conditioned and focused laser beam to the area of interest in a controlled manner. Single or multi-laser beam arrangements, as well as different shapes and sizes of laser beam spots are contemplated.

Abstract: The manufacturing methodology to produce polycrystalline silicon in time and cost efficient manner uses a spatially selective crystallization approach to greatly reduce the amount of energy delivered to the work surface. The amorphous silicon film is subjected to laser radiation substantially exclusively at localized areas where TFTs are to be formed. The source of radiation is a copper vapor laser which produces a highly stable radiation in a visible spectrum with an energy sufficient to convert amorphous silicon into polysilicon in 1-3 shots. The optic system delivers the homogenized, conditioned and focused laser beam to the area of interest in a controlled manner. Single or multi-laser beam arrangements, as well as different shapes and sizes of laser beam spots are contemplated.

Abstract: A method utilizing spatially selective laser doping for irradiating predetermined portions of a substrate of a semiconductor material is disclosed. Dopants are deposited onto the surface of a substrate. A pulsed, visible beam is directed to and preferentially absorbed by the substrate only in those regions requiring doping. Spatial modes of the incoherent beam are overlapped and averaged, providing uniform irradiation requiring fewer laser shots. The beam is then focused to the predetermined locations of the substrate for implantation or activation of the dopants. The method provides for scanning and focusing of the beam across the substrate surface, and irradiation of multiple locations using a plurality of beams. The spatial selectivity, combined with visible laser wavelengths, provides greater efficiency in doping only desired substrate regions, while reducing the amount of irradiation required.

Abstract: Methods of depositing thin film materials having crystalline content are provided. The methods use plasma enhanced chemical vapor deposition. According to one embodiment of the present invention, microcrystalline silicon films are obtained. According to a second embodiment of the present invention, crystalline films of zinc oxide are obtained. According to a third embodiment of the present invention, crystalline films of iron oxide are obtained.