Patents by Inventor Paul Wildes

Paul Wildes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10716213
    Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
    Type: Grant
    Filed: July 28, 2018
    Date of Patent: July 14, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Hyunjun Kim, Andy Becker, Jim Fitzke, Brad Smith, Paul Wildes
  • Patent number: 10595394
    Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: March 17, 2020
    Assignee: Cray Inc.
    Inventors: Hyunjun Kim, Paul Wildes, Andy Becker, Shawn Utz
  • Publication number: 20200037448
    Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
    Type: Application
    Filed: July 28, 2018
    Publication date: January 30, 2020
    Inventors: Hyunjun Kim, Andy Becker, Jim Fitzke, Brad Smith, Paul Wildes
  • Patent number: 10154581
    Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: December 11, 2018
    Assignee: Cray Inc.
    Inventors: Andy Becker, Hyunjun Kim, Shawn Utz, Paul Wildes
  • Publication number: 20180228019
    Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 9, 2018
    Inventors: Andy Becker, Hyunjun Kim, Shawn Utz, Paul Wildes
  • Patent number: 9721381
    Abstract: A system, method, and computer program product are provided for discarding pixel samples. The method includes the steps of completing shading operations for a pixel set including one or more pixels to generate per-sample shaded attributes according to a shader program executed by a processing pipeline. Discard information for the pixel set is evaluated and one or more per-sample shaded attributes for at least one pixel in the pixel set are discarded based on the evaluated discard information.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: August 1, 2017
    Assignee: NVIDIA Corporation
    Inventors: Christian Jean Rouet, Manan Maheshkumar Patel, Shirish Gadre, Daniel Paul Wilde
  • Publication number: 20150103087
    Abstract: A system, method, and computer program product are provided for discarding pixel samples. The method includes the steps of completing shading operations for a pixel set including one or more pixels to generate per-sample shaded attributes according to a shader program executed by a processing pipeline. Discard information for the pixel set is evaluated and one or more per-sample shaded attributes for at least one pixel in the pixel set are discarded based on the evaluated discard information.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 16, 2015
    Applicant: NVIDIA Corporation
    Inventors: Christian Jean Rouet, Manan Maheshkumar Patel, Shirish Gadre, Daniel Paul Wilde
  • Patent number: 5715421
    Abstract: An intuitive precharge sequencing technique for improving memory access through elimination of delay time incurred through precharging during page mode access of DRAM type memory. Current and prior page address access request information is used to generate a prediction as to whether the next address request will cross a page boundary and, therefore, require precharging of a new page. The predicted new page is then precharged before access is requested. Further advantages are obtained by providing an enable/disable feature, which allows either software or hardware to initiate or deactivate the operation of the precharge request in association with current or historical operating characteristics for a particular processor or program tasks. Where desired or practical, multiple levels of predictive analysis are used to refine the accuracy of trend predictions.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: February 3, 1998
    Assignee: Seiko Epson Corporation
    Inventors: James Edwin Akiyama, Daniel Paul Wilde