Abstract: The invention relates to a process chamber (10) for carrying out thermal processes in the manufacture of an electronic assembly (30), comprising the following: at least one opening (20) for introducing and/or removing the electronic assembly (30); a device (40) for supplying a gas; a controllable protection device (50) which is arranged on the opening (20) in order to reduce a leakage of gas from the process chamber, wherein the controllable protection device (50) comprises a first movable element (50A) as an integral piece which covers the width between the total width of the opening and the width of the electronic assembly; a device for detecting data relating to the dimensions of the electronic assembly (30); and a controller (60) which can control the protection device (50) on the basis of the data relating to the dimensions of the electronic assembly (30) such that when the electronic assembly (30) passes through the opening (20), a defined spacing is constantly maintained between the electronic assembly

Abstract: A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

Abstract: There is provided a pram frame (200) comprising a first roller attachment point (221) configured to engage with a first roller set (121) and a mechanism (231) configured to engage with the first roller set (121) via the first roller attachment point (221). The mechanism (231) is configured to provide driven steering of the first roller set (121) when a user steers the pram frame (200).

Abstract: Reflow condensation soldering machine comprising a circulation system for a heat transfer medium, the reflow condensation soldering machine comprising the circulation system, a centrifuge and a condensation device for the heat transfer medium.

Abstract: A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

Abstract: A load-handling vehicle, including a body; a boom, pivotally mounted to the body at a rear end region so that the boom can pivot up and down about an axis extending laterally with respect to the vehicle, wherein the boom has a load carrying implement attachable at a forward end region thereof; a steerable ground engageable propulsion arrangement; an electrically powered drive for the propulsion arrangement; a platform positioned at the rear of the body and to the side of the boom; and a battery pack positioned on the platform.

Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

Abstract: To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

Abstract: A load carrying device comprises a load carrying portion, a roller and an inflation arrangement in connection with the roller for selectively inflating the roller from a deflated state to an inflated state and for selectively deflating the roller from the inflated state to the deflated state, the roller rotatable to allow movement of the load carrying device, the roller comprising: an attachment arrangement attaching the roller to the load carrying portion so that the roller provides support to the load carrying portion; and a body for contacting a surface on which the load carrying device is located.

Abstract: A load-handling vehicle, including a body; a boom, pivotally mounted to the body at a rear end region so that the boom can pivot up and down about an axis extending laterally with respect to the vehicle, wherein the boom has a load carrying implement attachable at a forward end region thereof; a steerable ground engageable propulsion arrangement; an electrically powered drive for the propulsion arrangement; a platform positioned at the rear of the body and to the side of the boom; and a battery pack positioned on the platform.

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.

Abstract: The various structures forming communication paths on a printed circuit board can create several undesired effects, especially when high frequency signals are considered. Non-functional pads created during the manufacturing process have the potential to create an undesired effect, but when the overall collection of non-functional pads are carefully configured, an optimized communication path can be formed. More specifically, by selectively removing some collection of the non-functional pads, the high frequency characteristics of the communication paths can be optimized.

Abstract: A system, method, and computer program product are provided for discarding pixel samples. The method includes the steps of completing shading operations for a pixel set including one or more pixels to generate per-sample shaded attributes according to a shader program executed by a processing pipeline. Discard information for the pixel set is evaluated and one or more per-sample shaded attributes for at least one pixel in the pixel set are discarded based on the evaluated discard information.

Abstract: A system, method, and computer program product are provided for discarding pixel samples. The method includes the steps of completing shading operations for a pixel set including one or more pixels to generate per-sample shaded attributes according to a shader program executed by a processing pipeline. Discard information for the pixel set is evaluated and one or more per-sample shaded attributes for at least one pixel in the pixel set are discarded based on the evaluated discard information.

Abstract: A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.

Abstract: A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.

Abstract: The present invention relates generally to a diagnostic assay and, more particularly, an assay for measuring cell-mediated immune reactivity. Even more particularly, the present invention provides an assay and a kit for measuring a cell-mediated response to an antigen using whole blood or other suitable biological sample. The assay may be conducted using ligands to immune effector molecules or at the nucleic acid level, screening for expression of genes encoding the immune effector molecules. The assay is useful in therapeutic and diagnostic protocols for human, livestock and veterinary and wild life applications.

Abstract: An intuitive precharge sequencing technique for improving memory access through elimination of delay time incurred through precharging during page mode access of DRAM type memory. Current and prior page address access request information is used to generate a prediction as to whether the next address request will cross a page boundary and, therefore, require precharging of a new page. The predicted new page is then precharged before access is requested. Further advantages are obtained by providing an enable/disable feature, which allows either software or hardware to initiate or deactivate the operation of the precharge request in association with current or historical operating characteristics for a particular processor or program tasks. Where desired or practical, multiple levels of predictive analysis are used to refine the accuracy of trend predictions.

Abstract: A utility vault shroud having a hatch cover is provided with a motorized operator for opening and closing a hatch for access thereto. The operator is mounted across the shroud access opening between the side walls thereof with a horizontal shaft which is connected to the hatch cover by pivot arms. In a preferred arrangement a battery back-up is provided for operation during power failure.