Patents by Inventor Paul Y. Y. Moy

Paul Y. Y. Moy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive metal-filled substrates via developing agents
    Patent number: 5252255
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: October 12, 1993
    Assignee: Akzo America Inc.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald E. Hutton
  • Conductive metal-filled composites via developing agents
    Patent number: 5173519
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: January 7, 1991
    Date of Patent: December 22, 1992
    Assignee: Akzo N.V.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald Hutton
  • Conductive metallization of substances without developing agents
    Patent number: 5059485
    Abstract: A conductive metal layer is formed on a substrate having a softening point above about 200.degree. C. by depositing copper and nickel particles having a substantially continuous oxide coating thereon on the substrate, and heating and pressing the metal particles at a temperature of at least 200.degree. C. Unlike similar methods wherein oxide coated metal particles are used, no developing agent is required to render the metal layer conductive. The coated substrates are useful for a variety of uses such as EMI shielding and printed circuit boards.
    Type: Grant
    Filed: November 16, 1989
    Date of Patent: October 22, 1991
    Assignee: Akzo America Inc.
    Inventors: William J. Parr, Paul Y. Y. Moy, Dieter Frank
  • Conductive metallization of substrates via developing agents
    Patent number: 4997674
    Abstract: A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
    Type: Grant
    Filed: June 6, 1988
    Date of Patent: March 5, 1991
    Assignee: Akzo America Inc.
    Inventors: William J. E. Parr, Ronald E. Hutton, Paul Y. Y. Moy, Dieter Frank, David A. Strawser
  • Conductive metal-filled substrates via developing agents
    Patent number: 4961879
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: October 9, 1990
    Assignee: Akzo America Inc.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald E. Hutton
  • Bicyclic phosphate ether, ester, and carbonate intumescent flame retardant compositions
    Patent number: 4801625
    Abstract: A flame resistant composition has (1) an organic polymeric substance (such as polypropylene) in intimate contact with (2) an ether, ester, or carbonate derivative of a bicyclic phosphorous compound (such as pentaerythritol phosphate) and (3) a gas producing compound (such as melamine or ammonium polyphosphate).
    Type: Grant
    Filed: August 27, 1987
    Date of Patent: January 31, 1989
    Assignee: AKZO America Inc.
    Inventors: William J. Parr, Arthur G. Mack, Paul Y. Y. Moy