Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

Abstract: Gas distribution apparatus to provide uniform flows of gases from a single source to multiple processing chambers are described. A valve upstream of a shared volume is controlled by at least two pressurizing sequences during a process it the processing chamber. The first pressurizing sequence opens and closes the upstream valve a first number of cycles and the second pressurizing sequence opens and closes the upstream valve less frequently after the first number of cycles. The open/close timing of the second pressurizing sequence occurs less frequently than the open/close timing of the first pressurizing sequence.

Abstract: A process chamber includes one or more vertical walls at least partially defining a chamber portion of the process chamber, and multiple zones located about a periphery of the one or more vertical walls, wherein one or more of the multiple zones extends from a top to a bottom of the one or more vertical walls. The process chamber further includes a plurality of temperature control devices, each thermally coupled to the one or more vertical walls in one of the multiple zones, and a controller coupled to the plurality of temperature control devices and configured to set temperatures of one or more of the plurality of temperature control devices to obtain temperature uniformity within 2% across a substrate located in the chamber portion.

Abstract: Disclosed are a slit valve apparatus and a method for controlling a slit valve. The slit valve apparatus includes a slit valve assembly and a servo-control system in communication with the slit valve assembly. The slit valve assembly includes at least one gate able to transition between an open position and a closed position, at least one pneumatic actuator, at least one proportional pneumatic valve including a plurality of controllers, and a continuous position sensor. The servo-control system includes a centralized controller that generates a control signal and adjusts the movement of the at least one gate based on the position trajectory for the gate, a linear position measurement of the gate from the continuous position sensor, and fluid pressure/flow measurements from the plurality of controllers.

Abstract: A depth measuring apparatus includes a camera assembly configured to capture a plurality of images of a target at a plurality of distances from the target. The depth measuring apparatus further includes a controller configured to, for each of a plurality of regions within the plurality of images: determine corresponding gradient values within the plurality of images; determine a corresponding maximum gradient value from the corresponding gradient values; and determine, based on the corresponding maximum gradient value, a depth measurement for a region of the plurality of regions.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

Abstract: A temperature-controllable process chamber configured to process substrates may include one or more vertical walls at least partially defining a chamber portion of the process chamber. Multiple zones may be located about a periphery of the one or more vertical walls and multiple temperature control devices are thermally coupled to the periphery of the one or more vertical walls in each of the multiple zones. A controller coupled to the temperature control devices may be configured to individually control temperatures of the multiple temperature control devices to obtain substantial temperature uniformity across a substrate located in the chamber portion. Other systems and methods of manufacturing substrates are disclosed.

Abstract: A depth measuring apparatus includes a camera assembly, a position sensor, and a controller. The camera assembly is configured to capture a plurality of images of a target at a plurality of distances from the target. The position sensor is configured to capture, for each of the plurality of images, corresponding position data associated with a relative distance between the camera assembly and the target. The controller is configured to, for each of a plurality of regions within the plurality of images: determine corresponding gradient values within the plurality of images; determine a corresponding maximum gradient value from the corresponding gradient values; and determine a depth measurement for the region based on the corresponding maximum gradient and the corresponding position data captured for an image from the plurality of images that includes the corresponding maximum gradient.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

Abstract: A temperature-controllable process chamber configured to process substrates may include one or more vertical walls at least partially defining a chamber portion of the process chamber. Multiple zones may be located about a periphery of the one or more vertical walls and multiple temperature control devices are thermally coupled to the periphery of the one or more vertical walls in each of the multiple zones. A controller coupled to the temperature control devices may be configured to individually control temperatures of the multiple temperature control devices to obtain substantial temperature uniformity across a substrate located in the chamber portion. Other systems and methods of manufacturing substrates are disclosed.

Abstract: A depth measuring apparatus includes a camera assembly, a position sensor, and a controller. The camera assembly is configured to capture a plurality of images of a target at a plurality of distances from the target. The position sensor is configured to capture, for each of the plurality of images, corresponding position data associated with a relative distance between the camera assembly and the target. The controller is configured to, for each of a plurality of regions within the plurality of images: determine corresponding gradient values within the plurality of images; determine a corresponding maximum gradient value from the corresponding gradient values; and determine a depth measurement for the region based on the corresponding maximum gradient and the corresponding position data captured for an image from the plurality of images that includes the corresponding maximum gradient.

Abstract: A depth measuring apparatus includes (1) a camera and lens assembly that captures image data for a sequence of images of a target including a plurality of depth levels; (2) a motion stage on which the camera and lens assembly or the target is positioned; (3) a motor connected to the motion stage that causes relative movement between the camera and lens assembly and the target at defined incremental values; (4) a position sensor that captures position data on the camera and lens assembly or the target at each of the defined incremental values; and (5) a controller that processes the captured image data and captured position data using an image gradient method and optimal focal distance to determine depths of the plurality of depth levels. Numerous other aspects are provided.

Abstract: A depth measuring apparatus includes (1) a camera and lens assembly that captures image data for a sequence of images of a target including a plurality of depth levels; (2) a motion stage on which the camera and lens assembly or the target is positioned; (3) a motor connected to the motion stage that causes relative movement between the camera and lens assembly and the target at defined incremental values; (4) a position sensor that captures position data on the camera and lens assembly or the target at each of the defined incremental values; and (5) a controller that processes the captured image data and captured position data using an image gradient method and optimal focal distance to determine depths of the plurality of depth levels. Numerous other aspects are provided.

Abstract: A dual-blade robot having overlapping frog-leg linkages is disclosed. The robot includes first and second arms, coplanar with each other and each rotatably coupled to a first blade, in a frog-leg configuration, and third and fourth arms, coplanar with each other and each rotatably coupled to a second blade, in a frog-leg configuration, where the third and fourth arms are vertically offset from the first and second arms. The third and fourth arms are configured to overlap at least a portion of the first and second arms when the first and second blades are in a retracted position. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: A dual-blade robot having overlapping frog-leg linkages is disclosed. The robot includes first and second arms, coplanar with each other and each rotatably coupled to a first blade, in a frog-leg configuration, and third and fourth arms, coplanar with each other and each rotatably coupled to a second blade, in a frog-leg configuration, where the third and fourth arms are vertically offset from the first and second arms. The third and fourth arms are configured to overlap at least a portion of the first and second arms when the first and second blades are in a retracted position. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: A robot assembly allowing remote actuation of a carriage supported robot. The robot assembly includes a track, a carriage moveable along the track, and a robot mounted to the carriage. The robot includes at least a first arm, and a first driven member coupled to the first arm. The robot assembly further includes a drive assembly having a first driving member, a first transmission member coupled to the first driving member and the first driven member, and a first drive motor coupled to the first driving member. The first drive motor is configured to move the first driving member causing remote rotation of the first driven member and rotation of the first arm. Substrate processing apparatus and methods of transporting a substrate within a substrate processing apparatus are also provided, as are numerous other aspects.

Abstract: A robot assembly allowing remote actuation of a carriage supported robot. The robot assembly includes a track, a carriage moveable along the track, and a robot mounted to the carriage. The robot includes at least a first arm, and a first driven member coupled to the first arm. The robot assembly further includes a drive assembly having a first driving member, a first transmission member coupled to the first driving member and the first driven member, and a first drive motor coupled to the first driving member. The first drive motor is configured to move the first driving member causing remote rotation of the first driven member and rotation of the first arm. Substrate processing apparatus and methods of transporting a substrate within a substrate processing apparatus are also provided, as are numerous other aspects.

Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.

Abstract: A wafer loading system accommodates sufficient wafer carriers to substantially maximize the processing speed capability of wafer processing systems. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading elements, such as overhead track systems. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. Methods of operating the loading system allow delivery and removal of wafers to and from the processing systems to meet or exceed the processing speeds of the processing systems.