Abstract: The present invention provides a composition for attracting a variety of fruit flies and related pests, said composition including short chain esters, long chain esters, alcohols and/or additional elements. The present invention also relates to apparatus for administering said composition, devices for attracting and trapping fruit flies and methods for use thereof.

Abstract: A method includes receiving survey information associated with a patient, the survey information comprising quality of life survey answers for questions associated with a quality of life category; automatically processing the survey information using an Artificial Intelligence (AI) alert decision support system to perform operations comprising: generating an embedding for the survey information; and using a model corresponding to the quality of life category to predict a change in a quality of life score for the patient for the quality of life category based on the embedded survey information; comparing the change in the quality of life score for the patient with a threshold; and generating an alert based on the comparison of the change in the quality of life score for the patient with the threshold.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: A recreational device including a single wheel having a rim with a track and a tire coupled to the rim. The recreational device further includes a central hub assembly positioned within the wheel and movably coupled to the track of the rim such that the central hub assembly is rotatable in the track about an axis of rotation of the wheel. The recreational device further includes a support plate coupled to the central hub assembly and configured to support a human foot, and a guard plate coupled to the central hub assembly. The recreational device is configured such that rotational movement of the central hub assembly is independent from rotational movement of the wheel.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: A lockout device includes a first ring portion positioned around a first side of a connector. A second ring portion is positioned around a second side of the connector. A fastener allows a user to selectively secure the ring portions thereby forming a tubular ring surrounding the connector. An inner facing protrusion extends toward a center of the tubular ring and into a gap present on the connector. The inner facing protrusion remains in the gap of the connector regardless of movement of the lockout device about the connector while the first ring portion is secured to the second ring portion. The inner facing protrusion holds the lockout device captive around the connector and the tubular ring covers a disconnection mechanism of the connector. A secondary tool is required in order to detach the first ring portion from the second ring portion for accessing the disconnection mechanism of the connector.

Abstract: A lockout device includes a first ring portion positioned around a first side of a connector. A second ring portion is positioned around a second side of the connector. A fastener allows a user to selectively secure the ring portions thereby forming a tubular ring surrounding the connector. An inner facing protrusion extends toward a center of the tubular ring and into a gap present on the connector. The inner facing protrusion remains in the gap of the connector regardless of movement of the lockout device about the connector while the first ring portion is secured to the second ring portion. The inner facing protrusion holds the lockout device captive around the connector and the tubular ring covers a disconnection mechanism of the connector. A secondary tool is required in order to detach the first ring portion from the second ring portion for accessing the disconnection mechanism of the connector.

Abstract: A configurable, connectorized system for providing RTU monitoring of field digital and analog parameters and transmitting data to the Central PLC system dramatically reduces the number of wire connections that must be made to connect sensors and actuators to a PLC system. The system is also extremely rugged and safe to be located in a hazardous environment.

Abstract: A lockout device includes a first ring portion positioned around a first side of a connector. A second ring portion is positioned around a second side of the connector. A fastener allows a user to selectively secure the ring portions thereby forming a tubular ring surrounding the connector. An inner facing protrusion extends toward a center of the tubular ring and into a gap present on the connector. The inner facing protrusion remains in the gap of the connector regardless of movement of the lockout device about the connector while the first ring portion is secured to the second ring portion. The inner facing protrusion holds the lockout device captive around the connector and the tubular ring covers a disconnection mechanism of the connector. A secondary tool is required in order to detach the first ring portion from the second ring portion for accessing the disconnection mechanism of the connector.

Abstract: An expanding pin system is described that can provide automated and/or power controlled locking and unlocking of an expanding pin assembly in a mechanical joint. For example, the expanding pin system can include an actuation assembly that includes a single actuator (e.g., motor) to control an expanding pin assembly for locking and unlocking a mechanical joint.

Abstract: A lockout device includes a first ring portion positioned around a first side of a connector. A second ring portion is positioned around a second side of the connector. A fastener allows a user to selectively secure the ring portions thereby forming a tubular ring surrounding the connector. An inner facing protrusion extends toward a center of the tubular ring and into a gap present on the connector. The inner facing protrusion remains in the gap of the connector regardless of movement of the lockout device about the connector while the first ring portion is secured to the second ring portion. The inner facing protrusion holds the lockout device captive around the connector and the tubular ring covers a disconnection mechanism of the connector. A secondary tool is required in order to detach the first ring portion from the second ring portion for accessing the disconnection mechanism of the connector.

Abstract: A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES chips mounted on the heatsink and electrically connected thereto, with each LES chip comprising connection pads and a light emitting area configured to emit light therefrom responsive to a received electrical power. The LES device also includes a flexible interconnect structure positioned on and electrically connected to each LES chip to provide for control LES operation of the array of LES chips, with the flexible interconnect structure further including a flexible dielectric film configured to conform to a shape of the heatsink and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.

Abstract: An electrical interconnect assembly for use in an integrated circuit package includes a mounting substrate having a thickness defined between a first surface and a second surface thereof and at least one electrically conductive pad formed on the first surface of the mounting substrate. A metallization layer coats a surface of the at least one electrically conductive pad and is electrically coupled thereto. The metallization layer also coats portion of the first surface of the mounting substrate and extends through at least one via formed through the thickness of the mounting substrate. A method of manufacturing an electrical interconnect assembly includes forming at least one top side contact pad on a top surface of a mounting substrate and depositing a metallization layer on the top side contact pad(s), on an exposed portion of the top surface, and into via(s) formed through a thickness of the mounting substrate.

Abstract: An electrical interconnect assembly for use in an integrated circuit package includes a mounting substrate having a thickness defined between a first surface and a second surface thereof and at least one electrically conductive pad formed on the first surface of the mounting substrate. A metallization layer coats a surface of the at least one electrically conductive pad and is electrically coupled thereto. The metallization layer also coats portion of the first surface of the mounting substrate and extends through at least one via formed through the thickness of the mounting substrate.

Abstract: An electrical interconnect assembly includes an insulating substrate, upper conductive pads coupled to a top surface of the insulating substrate, and lower conductive pads coupled to a bottom surface of the insulating substrate. The upper conductive pads and the lower conductive pads comprise an electrically conductive material. A metallization layer is deposited on the top surface of the insulating substrate and the upper conductive pads. The metallization layer extends through vias formed through a thickness of the insulating substrate to contact a top surface of the lower conductive pads.

Abstract: A chip package includes a first substrate having at least one circuit layer formed on a first surface thereof, a first die mounted on a second surface of the first substrate opposite from the first surface, and an interconnection assembly comprising upper and lower conductive layers provided on an insulating substrate, with the upper conductive layer of the interconnection assembly affixed to the second surface of the first substrate and electrically connected to the at least one circuit layer of the first substrate. A second substrate is positioned on a side of the first die opposite from the first substrate so as to position the die between the first and second substrates, the second substrate having at least one circuit layer formed on an outward facing first surface thereof that is electrically connected to at least one of the lower conductive layers of the interconnection assembly and the first die.

Abstract: A CoDec in a design for test integrated circuit. In embodiments described herein, portions of the CoDec are distributed over the area of the IC. In particular, both the compressor and the decompressor may be distributed over the IC. To this end, XOR gates are located locally to the scan chains over the area of the chip to reduce wire length back to the input/output test pins. The compressor and decompressor may be distributed in a 2-dimensional grid. The compressor may XOR each scan chain in two different directions such that a fault may be resolved back to a specific region of the IC.