Abstract: A method for manufacturing a capacitor structure for quantum integrated circuits, in particular superconducting quantum integrated circuits, comprising: providing a first wafer structure comprising a first substrate; providing a second wafer structure comprising a second substrate; a heterostructure on the second substrate, the heterostructure comprising a buried etch stop layer, a dielectric layer on the etch stop layer, and a second metal film deposited on the etch stop layer of the heterostructure; bonding the first wafer structure and the second wafer structure together using the second metal film as bonding medium, thereby forming a bonded layer stack sandwiched between the first and the second substrate, the bonded layer stack comprising the buried etch stop layer, the dielectric layer and the second metal film; stripping the second substrate from the second wafer structure, stopping on the buried etch stop layer; selectively removing the buried etch stop layer from the bonded layer stack, thereby expos

Abstract: Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.

Abstract: Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.