Patents by Inventor Pauline Chiang

Pauline Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photocurable dicing die bonding tape
    Patent number: 8546485
    Abstract: A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: October 1, 2013
    Assignee: Henkel Corporation
    Inventors: Byoungchul Lee, Pauline Chiang, Kevin Harris Becker