Abstract: The central region of a leadframe (101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201), is selectively etched to leave upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Subsequently, during the packaging process, an integrated circuit (3) is located on the central region of the leadframe, and wires (107) are formed between the upright portions of the leadframe and contacts (5) of the integrated circuit (3), which are to be grounded. Subsequently, the wires and upright portions of the leadframe are encased in resin (116). Since the upright portions of the leadframe are encased in resin, the resin (116) is mechanically locked to the leadframe. Furthermore, any delamination that occurs between the resin (116) and the leadframe cannot propagate easily up the sides of the upright portions as far as the wires (107), so the wires (107) are unlikely to be torn from the upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204).