Patents by Inventor Paulo S. MOTTA

Paulo S. MOTTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low heat transfer encapsulation for high sensitivity and low power environmental sensing applications
    Patent number: 10436731
    Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: October 8, 2019
    Assignee: Apple Inc.
    Inventors: Paulo S. Motta, Roberto M. Ribeiro, Richard Yeh
  • LOW HEAT TRANSFER ENCAPSULATION FOR HIGH SENSITIVITY AND LOW POWER ENVIRONMENTAL SENSING APPLICATIONS
    Publication number: 20190033242
    Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 31, 2019
    Inventors: Paulo S. MOTTA, Roberto M. RIBEIRO, Richard YEH