Abstract: A method for locating phase to ground faults in DC distribution systems. The method includes utilizing wavelet analysis using Multi-Resolution Analysis (MRA) as a signal processing tool for recognition of characteristic features in the voltage signal. The voltage signal contains characteristic information in the high frequency range above the switching frequencies of the PE converters which allows for localization of the fault.

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract: A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable feature is formed using a dry etch process. Since the moveable feature is free to move upon its formation using the dry etch process, no stiction issues arise using the systems and methods described here.

Abstract: A method for locating phase to ground faults in DC distribution systems. The method includes utilizing wavelet analysis using Multi-Resolution Analysis (MRA) as a signal processing tool for recognition of characteristic features in the voltage signal. The voltage signal contains characteristic information in the high frequency range above the switching frequencies of the PE converters which allows for localization of the fault.

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract: A method for forming through wafer vias in a substrate uses a Cr/Au seed layer to plate the bottom of a blind trench formed in the front side of a substrate. Thereafter, a reverse plating process uses a forward current to plate the bottom and sides of the blind hole, and a reverse current to de-plate material in or near the top. Using the reverse pulse plating technique, the plating proceeds generally from the bottom of the blind hole to the top. To form the through wafer via, the back side of the substrate is ground or etched away to remove material up to and including the dead-end wall of the blind hole.

Abstract: Bidirectional wavelength cross connects include a plurality of ports, each configured to receive an input optical signals, each input optical signal having a plurality of spectral bands. At least one of the plurality of ports is disposed to simultaneously transmit an output optical signal having at least one of the spectral bands. A plurality of wavelength routing elements are configured to selectively route input optical signal spectral bands to output optical signals.

Abstract: Low height imaging systems may include one or more optical channels and a detector array. Each of the optical channels may be associated with one or more detectors of the array, have one or more optical components and a restrictive ray corrector, and be configured to direct steeper incident angle field rays onto the detectors. Alternatively, each of the optical channels may be associated with at least one detector, and have an aspheric GRIN lens. Another low height imaging system has an array of detectors and a GRIN lens having a surface with wavefront coding and configured to direct steeper incident angle field rays onto more than one of the detectors. One method forms a lens with wavefront coding. The method includes positioning a lens in a mold; and curing material onto a surface of the lens to form an aspheric surface of the lens with wavefront coding.

Abstract: An iris image capture device includes an optical arrangement that utilizes Wavefront Coding phase modifications to produce an optical image of a user iris and a detector for detecting the optical iris image and for converting the optical iris image into an electronic data signal. The iris image capture device also includes an image processor configured for processing the electronic data signal from the detector to reverse the Wavefront Coding phase modifications and to produce an electronic iris image of the user iris.