Patents by Inventor Paulus H. M. Keizer

Paulus H. M. Keizer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Breakdown-resistant thin film capacitor with interdigitated structure
    Patent number: 6999297
    Abstract: The invention relates to a thin film capacitor with a carrier substrate, at least two interdigitated electrodes, and a dielectric. A staggered arrangement of at least one interdigitated electrode below the dielectric with respect to an interdigitated electrode above the dielectric results in a breakdown-resistant thin film capacitor which can be manufactured in the same production process as a standard monolayer capacitor.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: February 14, 2006
    Assignee: U.S. Philips Corporation
    Inventors: Mareike Klee, Wilhelm Herrmann, Uwe Mackens, Paulus H. M. Keizer