Patents by Inventor Paulus M. C. Hesen

Paulus M. C. Hesen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a microelectronic package comprising at least one microelectronic device
    Patent number: 8232628
    Abstract: A method for manufacturing a microelectronic package (1) comprises the steps of providing two parts (13, 14) comprising electrically insulating material such as plastic; providing members (21, 22, 23) comprising electrically conductive material; providing a microelectronic device (30); positioning the electrically conductive members (21, 22, 23) and the microelectronic device (30) on the electrically insulating parts (13, 14); and placing the electrically insulating parts (13, 14) against each other, wherein the microelectronic device (30) and portions of the electrically conductive members (21, 22, 23) are sandwiched between the electrically insulating parts (13, 14). The electrically conductive members (21, 22, 23) are intended to be used for realizing contact of the microelectronic device (30) arranged inside the package (1) to the external world.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: July 31, 2012
    Assignee: NXP B.V.
    Inventors: Paulus M. C. Hesen, Antonius J. G. M. van den Berk, Richard van Lieshout
  • METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE
    Publication number: 20110062565
    Abstract: A method for manufacturing a microelectronic package (1) comprises the steps of providing two parts (13, 14) comprising electrically insulating material such as plastic; providing members (21, 22, 23) comprising electrically conductive material; providing a microelectronic device (30); positioning the electrically conductive members (21, 22, 23) and the microelectronic device (30) on the electrically insulating parts (13, 14); and placing the electrically insulating parts (13, 14) against each other, wherein microelectronic device (30) and portions of the electrically conductive members (21, 22, 23) are sandwiched between the electrically insulating parts (13, 14). The electrically conductive members (21, 22, 23) are intended to be used for realizing contact of the micro-electronic device (30) arranged inside the package (1) to the external world.
    Type: Application
    Filed: December 30, 2008
    Publication date: March 17, 2011
    Applicant: NXP B.V.
    Inventors: Paulus M. C. Hesen, Antonius J. G. M. Van Den Berk, Richard Van Lieshout