Patents by Inventor Paulus Martinus Catharina Hesen

Paulus Martinus Catharina Hesen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing methods for a sensor package including a lead frame
    Patent number: 9222989
    Abstract: A sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: December 29, 2015
    Assignee: NXP B.V.
    Inventors: Paulus Martinus Catharina Hesen, Roelf Anco Jacob Groenhuis, Johannes Wilhelmus Dorotheus Bosch
  • Method for manufacturing a microelectronic package comprising at least one microelectronic device
    Patent number: 8884410
    Abstract: A method for manufacturing a microelectronic package (1) comprises the steps of providing at least two members (10, 11, 16) comprising electrically conductive material; providing a microelectronic device (15); placing the electrically conductive members (10, 11, 16) and the microelectronic device (15) in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members (10, 11, 16) and the microelectronic device (15); and providing a non-conductive material for encapsulating the microelectronic device (15) and a portion of the electrically conductive members (10, 11, 16) connected thereto. The electrically conductive members (10, 11, 16) are intended to be used for realizing contact of the microelectronic device (15) arranged inside the package (1) to the external world.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: November 11, 2014
    Assignee: NXP B.V.
    Inventors: Peter Wilhelmus Maria Van De Water, Paulus Martinus Catharina Hesen, Roelf Anco Jacob Groenhuis
  • SENSOR PACKAGE
    Publication number: 20140130346
    Abstract: Sensor package 1 and a corresponding manufacturing method, wherein the sensor package 1 includes several components like a magneto resistive sensor 40 and electronic components 30, and the orientation of the elements and components is maintained by a moulding body 200 manufactured in a single moulding step.
    Type: Application
    Filed: January 15, 2014
    Publication date: May 15, 2014
    Applicant: NXP B.V.
    Inventors: Paulus Martinus Catharina HESEN, Roelf Anco Jacob GROENHUIS, Johannes Wilhelmus Dorotheus BOSCH
  • Sensor packages including a lead frame and moulding body and methods of manufacturing
    Patent number: 8664946
    Abstract: In one embodiment, a sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: March 4, 2014
    Assignee: NXP B.V.
    Inventors: Paulus Martinus Catharina Hesen, Roelf Anco Jacob Groenhuis, Johannes Wilhelmus Dorotheus Bosch
  • METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE
    Publication number: 20110198738
    Abstract: A method for manufacturing a microelectronic package (1) comprises the steps of providing at least two members (10, 11, 16) comprising electrically conductive material; providing a microelectronic device (15); placing the electrically conductive members (10, 11, 16) and the microelectronic device (15) in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members (10, 11, 16) and the microelectronic device (15); and providing a non-conductive material for encapsulating the microelectronic device (15) and a portion of the electrically conductive members (10, 11, 16) connected thereto. The electrically conductive members (10, 11, 16) are intended to be used for realizing contact of the microelectronic device (15) arranged inside the package (1) to the external world.
    Type: Application
    Filed: October 16, 2009
    Publication date: August 18, 2011
    Applicant: NXP B.V.
    Inventors: Peter WIilhelmus Maria Van De Water, Paulus Martinus Catharina Hesen, Roelf Anco Jacob Groenhuis
  • SENSOR PACKAGE
    Publication number: 20100117171
    Abstract: Sensor package 1 and a corresponding manufacturing method, wherein the sensor package 1 includes several components like a magneto resistive sensor 40 and electronic components 30, and the orientation of the elements and components is maintained by a moulding body 200 manufactured in a single moulding step.
    Type: Application
    Filed: February 13, 2008
    Publication date: May 13, 2010
    Applicant: NXP, B.V.
    Inventors: Paulus Martinus Catharina Hesen, Roelf Anco Jacob Groenhuis, Johannes Wilhelmus Dorotheus Bosch