Patents by Inventor Paulus Stefan

Paulus Stefan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8633581
    Abstract: A semiconductor device includes a carrier, a chip attached to the carrier, and an encapsulation body disposed over the chip and the carrier. An exterior surface of the semiconductor device includes an exposed peripheral edge of at least two of the carrier, the chip, and the encapsulation body.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: January 21, 2014
    Assignee: Infineon Technologies AG
    Inventors: See Beng Keh, Paulus Stefan, Auburger Albert, Wietschorke Helmut
  • Publication number: 20100230799
    Abstract: A semiconductor device includes a carrier, a chip attached to the carrier, and an encapsulation body disposed over the chip and the carrier. An exterior surface of the semiconductor device includes an exposed peripheral edge of at least two of the carrier, the chip, and the encapsulation body.
    Type: Application
    Filed: March 13, 2009
    Publication date: September 16, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: See Beng Keh, Paulus Stefan, Auburger Albert, Wietschorke Helmut