Patents by Inventor Pavan Vishwanath
Pavan Vishwanath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240103847Abstract: Systems and methods provide multi-channel transmission of a firmware image to a hardware component of an IHS (Information Handling System), where the firmware image is transmitted by a remote access controller of the IHS that supports remote management of the IHS. Upon a firmware being initiated, the remote access controller determines an available bandwidth of a first signaling pathway of the hardware component and also determines an available bandwidth of a second signaling pathway of the hardware component. One portion of the firmware image is transmitted to the hardware component using the first signaling pathway, where a size of that portion is selected based on the available bandwidth of the first signaling pathway. Another portion of the firmware image is transmitted to the hardware component using the second signaling pathway, where a size of that portion is selected based on the available bandwidth of the second signaling pathway.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Applicant: Dell Products, L.P.Inventors: Mahesh Babu Ramaiah, Rama Rao Bisa, Manjunath AM, Manjunath Vishwanath, Pavan Kumar Gavvala, Balamurugan Gnanasambandam, Naveen Karthick Chandrasekaran
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Publication number: 20240103971Abstract: Systems and methods include a remote access controller of an IHS (Information Handling System) that provides remote management of the IHS. The remote access controller initiates an update of firmware used to operate a hardware component of the IHS by transmitting a firmware image to the hardware component via a first signaling pathway connecting the remote access controller to the hardware component. The remote access controller detects a failure in transmission of the firmware image to the hardware component via the first signaling pathway and identifies a second signaling pathway connecting the remote access controller to the hardware component. The remote access controller resumes transmission of the firmware image to the hardware component via the second signaling pathway and the firmware used to operate the hardware component is updated using the transmitted firmware image.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Applicant: Dell Products, L.P.Inventors: Manjunath Vishwanath, Rama Rao Bisa, Pavan Kumar Gavvala, Manjunath AM, Mahesh Babu Ramaiah, Naveen Karthick Chandrasekaran, Darshan Hebbar, Shantanu Kumar Pradhan
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Publication number: 20240103849Abstract: Embodiments of systems and methods to provide a firmware update to devices configured in a redundant configuration in an Information Handling System (IHS) are disclosed. In an illustrative, non-limiting embodiment, an IHS may include computer-executable instructions to receive a firmware update image associated with the firmware device, determine that the firmware update image possesses a critical sub-image portion, and schedule a firmware update to be performed in the future on the firmware device using the one firmware update image. The firmware update image conforms to a Platform Level Data Model (PLDM) protocol that is configured to perform rebootless firmware updates.Type: ApplicationFiled: September 27, 2022Publication date: March 28, 2024Applicant: Dell Products, L.P.Inventors: Manjunath Vishwanath, Rama Rao Bisa, Pavan Kumar Gavvala, Manjunath AM, Shantanu Kumar Pradhan, Chandrasekhar R
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Publication number: 20240103830Abstract: In various embodiments, a remote access controller supporting remote management of an Information Handling System (IHS). The remote access controller receives a first firmware image comprising first firmware for a first hardware component of the IHS. A personality of the first firmware is determined and at least a portion of the first firmware is stored to a first region of a persistent storage of the first hardware component, where the first region is designated as storing firmware for adapting the first hardware component to the first personality. In response to a detected reconfiguration of the IHS, the remote access controller generates a notification of the first firmware that is stored by the first hardware component and that is usable to adapt operation of the first hardware component to the first personality.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Applicant: Dell Products, L.P.Inventors: Deepaganesh Paulraj, Kala Sampathkumar, Rama Rao Bisa, Darshan Hebbar, Manjunath AM, Elie Antoun Jreij, Naveen Karthick Chandrasekaran, Pavan Kumar Gavvala, Manjunath Vishwanath, Sivakami Velusamy
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Patent number: 11389865Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: June 12, 2015Date of Patent: July 19, 2022Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
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Publication number: 20220169905Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 4, 2021Publication date: June 2, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11162007Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: March 1, 2019Date of Patent: November 2, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20190194517Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10259980Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: October 29, 2013Date of Patent: April 16, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20170144221Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: ApplicationFiled: June 12, 2015Publication date: May 25, 2017Inventors: Shamik GHOSHAL, V. Sathish KUMAR, Pavan VISHWANATH, Ranjit S. PANDHER, Remya CHANDRAN, Sutapa MUKHERJEE, Siuli SARKAR, Bawa SINGH, Ravindra Mohan BHATKAL
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Publication number: 20150353804Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 29, 2013Publication date: December 10, 2015Applicant: ALPHA METALS, INC.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki