Patents by Inventor Pavel B. Lembrikov
Pavel B. Lembrikov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10788512Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: GrantFiled: April 2, 2019Date of Patent: September 29, 2020Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 10416192Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: GrantFiled: October 29, 2015Date of Patent: September 17, 2019Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20190227099Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: April 2, 2019Publication date: July 25, 2019Applicant: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20160109481Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 29, 2015Publication date: April 21, 2016Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20140231264Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: April 23, 2014Publication date: August 21, 2014Inventors: Richard T. Chen, Ezekiel J.J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 8729916Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip and a compliant body wherein a portion of the complaint body is formed, then the contact tip is formed and then finally the rest of the compliant body is formed, wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.Type: GrantFiled: October 14, 2011Date of Patent: May 20, 2014Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 8723543Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip, a compliant body, and a bonding material that can be used in bonding the probe to a substrate and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.Type: GrantFiled: October 14, 2011Date of Patent: May 13, 2014Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 8717054Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.Type: GrantFiled: October 14, 2011Date of Patent: May 6, 2014Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 8717055Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.Type: GrantFiled: October 3, 2011Date of Patent: May 6, 2014Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20120062260Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 3, 2011Publication date: March 15, 2012Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20120061009Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 14, 2011Publication date: March 15, 2012Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20120064227Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 14, 2011Publication date: March 15, 2012Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20120064226Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 14, 2011Publication date: March 15, 2012Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20110187398Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: February 11, 2011Publication date: August 4, 2011Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20110187397Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: February 11, 2011Publication date: August 4, 2011Inventors: Richard T. Chen, Ezekiel J.J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Patent number: 7878385Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.Type: GrantFiled: October 30, 2007Date of Patent: February 1, 2011Assignee: Microfabrica Inc.Inventors: Ananda H. Kumar, Ezekiel J. J. Kruglick, Adam L. Cohen, Kieun Kim, Gang Zhang, Richard T. Chen, Christopher A. Bang, Vacit Arat, Michael S. Lockard, Uri Frodis, Pavel B. Lembrikov, Jeffrey A. Thompson
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Publication number: 20100176834Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: March 15, 2010Publication date: July 15, 2010Inventors: Richard T. Chen, Ezekiel J.J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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Publication number: 20100136851Abstract: Embodiments of the invention provide electrochemical fabrication processes that may be used for the fabrication of space transformers or the co-fabrication of microprobe arrays along with one or more space transformers.Type: ApplicationFiled: December 16, 2009Publication date: June 3, 2010Inventors: Adam L. Cohen, Vacit Arat, Michael S. Lockard, Christopher A. Bang, Pavel B. Lembrikov
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Publication number: 20100094320Abstract: Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.Type: ApplicationFiled: November 6, 2009Publication date: April 15, 2010Inventors: Vacit Arat, Richard T. Cohen, Ming Ting Wu, Pavel B. Lembrikov, Adam L. Cohen
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Patent number: 7679388Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: GrantFiled: April 2, 2007Date of Patent: March 16, 2010Assignee: Microfabrica Inc.Inventors: Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov