Patents by Inventor Pavel Lembrikov
Pavel Lembrikov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230201968Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).Type: ApplicationFiled: April 18, 2022Publication date: June 29, 2023Applicant: Microfabrica Inc.Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
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Patent number: 9878401Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).Type: GrantFiled: May 22, 2015Date of Patent: January 30, 2018Assignee: Microfabrica Inc.Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
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Patent number: 9533376Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).Type: GrantFiled: January 15, 2014Date of Patent: January 3, 2017Assignee: Microfabrica Inc.Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
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Publication number: 20140197145Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).Type: ApplicationFiled: January 15, 2014Publication date: July 17, 2014Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
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Publication number: 20080105355Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
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Publication number: 20080100326Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20080093424Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.Type: ApplicationFiled: October 30, 2007Publication date: April 24, 2008Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
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Publication number: 20070182427Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: April 2, 2007Publication date: August 9, 2007Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20070170940Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: April 2, 2007Publication date: July 26, 2007Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20070170943Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: April 2, 2007Publication date: July 26, 2007Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20060108678Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.Type: ApplicationFiled: June 30, 2005Publication date: May 25, 2006Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
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Publication number: 20050223543Abstract: Embodiments of the invention provide electrochemical fabrication processes that may be used for the fabrication of space transformers or the co-fabrication of microprobe arrays along with one or more space transformers.Type: ApplicationFiled: January 3, 2005Publication date: October 13, 2005Inventors: Adam Cohen, Vacit Arat, Michael Lockard, Christopher Bang, Pavel Lembrikov
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Publication number: 20050212539Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: January 3, 2005Publication date: September 29, 2005Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20050189958Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: January 3, 2005Publication date: September 1, 2005Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20050179458Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.Type: ApplicationFiled: January 3, 2005Publication date: August 18, 2005Inventors: Richard Chen, Ezekiel Kruglick, Christopher Bang, Dennis Smalley, Pavel Lembrikov
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Publication number: 20050023146Abstract: Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.Type: ApplicationFiled: May 7, 2004Publication date: February 3, 2005Applicant: Microfabrica Inc.Inventors: Pavel Lembrikov, Dennis Smalley, Adam Cohen