Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.

Abstract: Aspects of the disclosure provide a circuit package. The circuit package includes a first signal terminal electrically coupled with a serializer/deserializer (SERDES), a second signal terminal electrically coupled with an external electronic component, and a trace disposed on an insulating layer. The trace is configured to transfer an electrical signal between the first signal terminal and the second signal terminal. The trace is patterned to provide a specific filtering characteristic to filter the electrical signal.

Abstract: Aspects of the disclosure provide a circuit package. The circuit package includes a first signal terminal electrically coupled with a serializer/deserializer (SERDES), a second signal terminal electrically coupled with an external electronic component, and a trace disposed on an insulating layer. The trace is configured to transfer an electrical signal between the first signal terminal and the second signal terminal. The trace is patterned to provide a specific filtering characteristic to filter the electrical signal.