Patents by Inventor Pawan K Nimmakayala

Pawan K Nimmakayala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7420654
    Abstract: The present invention is directed toward a method to vary dimensions of a substrate supported by a chuck. The method includes applying compressive forces to the substrate with the actuator assembly while facilitating movement of the actuator assembly with respect to the substrate to minimize reactive forces generated in response to the compressive forces being sensed by the chuck.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: September 2, 2008
    Assignee: Molecular Imprints, Inc.
    Inventors: Anshuman Cherala, Byung-Jin Choi, Pawan K. Nimmakayala, Mario J. Meissl, Sidlgata V. Sreenivasan
  • Patent number: 7323130
    Abstract: The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded pattern may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer. These and other embodiments of the present invention are discussed more fully below.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: January 29, 2008
    Assignee: Molecular Imprints, Inc.
    Inventors: Pawan K. Nimmakayala, Sidlgata V. Sreenivasan, Byung-Jin Choi, Anshuman Cherala
  • Patent number: 7298456
    Abstract: The present invention is directed toward a system to vary dimensions of a substrate, such as a template having a patterned mold. To that end, the system includes a substrate chuck adapted to position the substrate in a region; a pliant member; and an actuator sub-assembly elastically coupled to the substrate chuck through the pliant member. The actuator assembly includes a plurality of lever sub-assemblies, one of which includes a body lying in the region and spaced-apart from an opposing body associated with one of the remaining lever sub-assemblies of the plurality of lever sub-assemblies. One of the plurality of lever assemblies is adapted to vary a distance between the body and the opposing body. In this manner, compressive forces may be applied to the template to remove unwanted magnification or other distortions in the pattern on the mold. The pliant member is configured to attenuate a magnitude of resulting Forces sensed by the substrate chuck generated in response to the compressive forces.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: November 20, 2007
    Assignee: Molecular Imprints, Inc.
    Inventors: Anshuman Cherala, Byung-Jin Choi, Pawan K. Nimmakayala, Mario J. Meissl, Sidlgata V. Sreenivasan
  • Patent number: 7170589
    Abstract: The present invention is directed toward a system to vary dimensions of a substrate, such as a template having a patterned mold. To that end, the system includes a substrate chuck adapted to position the substrate in a region; a pliant member; and an actuator sub-assembly elastically coupled to the substrate chuck through the pliant member. The actuator assembly includes a plurality of lever sub-assemblies, one of which includes a body lying in the region and spaced-apart from an opposing body associated with one of the remaining lever sub-assemblies of the plurality of lever sub-assemblies. One of the plurality of lever assemblies is adapted to vary a distance between the body and the opposing body. In this manner, compressive forces may be applied to the template to remove unwanted magnification or other distortions in the pattern on the mold. The pliant member is configured to attenuate a magnitude of resulting forces sensed by the substrate chuck generated in response to the compressive forces.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: January 30, 2007
    Assignee: Molecular Imprints, Inc.
    Inventors: Anshuman Cherala, Byung-Jin Choi, Pawan K Nimmakayala, Mario J. Meissl, Sidlgata V. Sreenivasan
  • Publication number: 20040146792
    Abstract: The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded patterned may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer.
    Type: Application
    Filed: December 12, 2003
    Publication date: July 29, 2004
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Pawan K. Nimmakayala, Sidlgata V. Sreenivasan, Byung-Jin Choi, Anshuman Cherala