Patents by Inventor Pawel Janus

Pawel Janus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8056402
    Abstract: By forming an appropriate material layer, such as a metal-containing material, on a appropriate substrate and patterning the material layer to obtain a cantilever portion and a tip portion, a specifically designed nano-probe may be provided. In some illustrative aspects, additionally, a three-dimensional template structure may be provided prior to the deposition of the probe material, thereby enabling the definition of sophisticated tip portions on the basis of lithography, wherein, alternatively or additionally, other material removal processes with high spatial resolution, such as FIB techniques, may be used for defining nano-probes, which may be used for electric interaction, highly resolved temperature measurements and the like. Thus, sophisticated measurement techniques may be established for advanced thermal scanning, strain measurement techniques and the like, in which a thermal and/or electrical interaction with the surface under consideration is required.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: November 15, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael Hecker, Ehrenfried Zschech, Piotr Grabiec, Pawel Janus, Teodor Gotszalk
  • Publication number: 20090114000
    Abstract: By forming an appropriate material layer, such as a metal-containing material, on a appropriate substrate and patterning the material layer to obtain a cantilever portion and a tip portion, a specifically designed nano-probe may be provided. In some illustrative aspects, additionally, a three-dimensional template structure may be provided prior to the deposition of the probe material, thereby enabling the definition of sophisticated tip portions on the basis of lithography, wherein, alternatively or additionally, other material removal processes with high spatial resolution, such as FIB techniques, may be used for defining nano-probes, which may be used for electric interaction, highly resolved temperature measurements and the like. Thus, sophisticated measurement techniques may be established for advanced thermal scanning, strain measurement techniques and the like, in which a thermal and/or electrical interaction with the surface under consideration is required.
    Type: Application
    Filed: May 2, 2008
    Publication date: May 7, 2009
    Inventors: Michael Hecker, Ehrenfried Zschech, Piotr Grabiec, Pawel Janus, Teodor Gotszalk