Patents by Inventor Pawel Kalinowski

Pawel Kalinowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104928
    Abstract: A process of modifying workflows associated with processing an incident scene in response to detecting contamination of the incident scene. An electronic computing device obtains a first image of an incident scene at a first point in time and analyzes the first image to detect a state of evidentiary items present at the incident scene. The device obtains a second image of the incident scene at a second point in time and detects a change in the state of the evidentiary items based on a comparison of the first and second images. When it is determined that one or more persons entered or exited the incident scene during a time period between the first point in time and the second point in time, the device detects that the incident scene has been contaminated and generates a workflow modification identifying one or more actions for execution by a workflow server.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Inventors: GRZEGORZ GUSTOF, LUKASZ OSUCH, MARCIN KALINOWSKI, DANIEL SEALS, PAWEL WILKOSZ
  • Patent number: 6357414
    Abstract: Central mounting of control electronics proximate to the engine is provided by attaching the electronics to an upper surface of the intake manifold to provide heat shielding and heat conduction for active components on the circuit card. The central location provides extremely short harnesses to important actuators located in cylinder heads of the engine thus reducing wiring clutter and cost.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: March 19, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Pawel Kalinowski, Bharat Z. Patel, Timothy J. Yerdon, John Trublowski, Prathap A. Reddy, Harvinder Singh
  • Patent number: 6299469
    Abstract: Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: October 9, 2001
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Andrew Zachary Glovatsky, Pawel Kalinowski, Richard Keith McMillan
  • Patent number: 5548481
    Abstract: An electronic module containing a heat sink member, a flexible printed circuit board with electrical components mounted on both sides, and a protective cover. The heat sink member has an external surface containing a plurality of protruding fins. Its internal surface contains a raised grid of ribs with cavities present between the ribs. The cavities contain ceramic-filled silicone for improved heat transfer between the electrical components present on the circuit board, and the heat sink member. High heat-producing components are mounted on one side of the circuit board and are thermally coupled with the heat sink member by means of copper-plated through-holes in the circuit board. The protective cover is mounted to the internal surface of the heat sink and encloses the printed circuit board. A connector assembly serves to connect the electronic module to external circuitry.
    Type: Grant
    Filed: September 19, 1994
    Date of Patent: August 20, 1996
    Assignee: Ford Motor Company
    Inventors: Kenneth A. Salisbury, Pawel Kalinowski, Jay D. Baker