Abstract: The electroplating process of the present invention is a cyclical operation having at least three essentially independent steps in each cycle of operation with the independent steps carried out in sequence and consisting of stirring, sedimentation and electroplating. The sedimentation step occurs over an essentially quiescent time interval with essentially no current flow through the electrolyte and essentially no stirring so as to form a sedimentation layer of loosely contacted particulates on said cathode plate. The electroplating step follows the sedimentation step at a current density of over at least 5 A/dm.sup.2. The stirring step immediately follows the step of electroplating with the stirring operation being sufficiently vigorous to disperse the particulates in the sedimentation layer and to break up particulates bridged by metallic coating formed during the previous step of electroplating.

Abstract: A method of electroplating particulates in a metallic ion containing electrolyte within an electroplating device having an anode and cathode plate by repeating the steps of stirring the particulates, allowing sedimentation of the particulates to occur by gravity until a sedimentation layer of loosely contacted particles is formed on the cathode plate of a suitable thickness and applying an electromotive potential across said anode and cathode plate to create an electric current in said electrolyte for electroplating metallic ions on the surface of the particulates in said sedimentation layer wherein the steps of stirring, sedimentation and electroplating are performed in sequence over repeated cycles which are maintained essentially independent of one another with the step of electroplating being interrupted during the steps of stirring and sedimentation and with the step of stirring immediately following the step of electroplating.