Patents by Inventor Payal Kaul

Payal Kaul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat shrinkable film with (meth)acrylate resin curable adhesive
    Patent number: 7700189
    Abstract: A heat shrinkable label comprises (A) a heat shrinkable film comprising at least one thermoplastic polymer, and (B) a curable adhesive comprising (1) at least one urethane (meth)acrylate resin having an average of about 1 to about 1.6 (meth)acrylate groups per resin molecule, (2) at least one tackifier, and (3) at least one photoinitiator, where the film has an ultimate shrinkage at 135° C. of at least 15%, and the adhesive has sufficient precure tack, wherein the loop tack of the uncured adhesive is at least 4.3 g/cm2. The heat shrinkable label is useful in high-speed industrial processes such as beverage container labeling.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: April 20, 2010
    Assignee: Avery Dennison Corporation
    Inventors: Moris Amon, Christopher J. Blackwell, Farid F. Ghiam, Patricia Ann Harman, Payal Kaul, Sunder R. Rajan, Richard K. Williams, Jr.
  • HEAT SHRINK FILMS AND ARTICLES ENCAPSULATED THEREIN
    Publication number: 20090068486
    Abstract: The present invention relates to a heat shrink film for encapsulating articles comprising a core layer having an upper surface and a lower surface, a first skin layer on the upper surface of the core layer, and a second skin layer underlying the lower surface of the core layer, wherein the core layer comprises a blend of (i) at least one polyterpene and (ii) a syndiotactic polypropylene or a cyclic olefin copolymer, wherein the ultimate shrinkage of the film is at least 25% at 135° C.
    Type: Application
    Filed: December 22, 2005
    Publication date: March 12, 2009
    Inventors: Christopher J. Blackwell, Kevin O. Henderson, Payal Kaul
  • HEAT SHRINKABLE FILM WITH (METH)ACRYLATE RESIN CURABLE ADHESIVE
    Publication number: 20070172669
    Abstract: A heat shrinkable label comprises (A) a heat shrinkable film comprising at least one thermoplastic polymer, and (B) a curable adhesive comprising (1) at least one urethane (meth)acrylate resin having an average of about 1 to about 1.6 (meth)acrylate groups per resin molecule, (2) at least one tackifier, and (3) at least one photoinitiator, where the film has an ultimate shrinkage at 135° C. of at least 15%, and the adhesive has sufficient precure tack, wherein the loop tack of the uncured adhesive is at least 4.3 g/cm2. The heat shrinkable label is useful in high-speed industrial processes such as beverage container labeling.
    Type: Application
    Filed: March 15, 2007
    Publication date: July 26, 2007
    Inventors: Moris Amon, Christopher Blackwell, Farid Ghiam, Patricia Harman, Payal Kaul, Sunder Rajan, Richard Williams