Abstract: The present invention relates to a solid-state laser comprising: a) a semiconductor pump laser, b) a lens integrated on the surface of said semiconductor pump laser, c) a packaging material consisting essentially of a spin-on glass material, wherein the spin-on glass material is processable at a process temperature of less than 225° C., and d) a lasing material layer having a highly reflective coating in both sides. The invention also relates to a process for producing such a solid-state laser, which process comprises applying spin-on glass material onto semiconductor wafers having VCSEL pump lasers using different coating methods, such as spin coating, and curing the glass film layer at temperatures <225° C.

Abstract: The present invention relates to a process for controlling and/or enhancing the light emission and/or amplitude of a light-emitting device comprising depositing on the surface of such light-emitting device a spin-on glass material at a process temperature of less than 225° C., wherein the spin-on glass material is directly patternable as a negative photoresist. The spin-on glass material is directly patternable using standard photolithography methods and may be used for the purpose of patterning mechanical stand-offs for light emitting device-packaging purposes.

Abstract: The present invention relates to a solid-state laser comprising: a) a semiconductor pump laser, b) a lens integrated on the surface of said semiconductor pump laser, c) a packaging material consisting essentially of a spin-on glass material, wherein the spin-on glass material is processable at a process temperature of less than 225° C., and d) a lasing material layer having a highly reflective coating in both sides. The invention also relates to a process for producing such a solid-state laser, which process comprises applying spin-on glass material onto semiconductor wafers having VCSEL pump lasers using different coating methods, such as spin coating, and curing the glass film layer at temperatures <225° C.

Abstract: A laser assembly including a silicon base and method are provided for assembling lasers on a platform in a reliable, low cost process that is suitable for high volume production. The platform can be a monolithic silicon base which has high thermal conductivity, a low coefficient of thermal expansion, and whose features can be formed with close tolerances in a low cost, reliable manner. Materials with similar coefficients of thermal expansion are used in order to maintain alignment during unexpected heating and cooling. Furthermore, a method is described that substantially eliminates the need for adhesives to bond laser components to a platform. The resultant laser can be very robust, stable, and can provide reliable operation over extended time periods.

Abstract: An apparatus and method are disclosed for use in an antenna remoting system. The apparatus comprises a single source of laser light having an output characterized by two distinct polarizations and at least two closely separated frequencies, and a fiber optic communications link joined to the source and having a modulator therein which is driven by a radio frequency information signal such that said modulator produces a beat frequency output which is a function of the sum of the two closely separated frequencies.

Abstract: Optical fiber measuring systems using an interferometer are disclosed. The measuring range of the system are extended by the use two wavelengths of radiation during the measurement. The phases of the light at each wavelength may be compared, or the radiation of one wavelength may be used to calibrate the radiation of the other wavelength.

Abstract: A flowmeter for measuring the velocity of fluid flow by monitoring the vortex shedding frequency of the fluid flow comprises a single mode optical fibre sensing element (1) for detecting vortex shedding and utilizes interferometric techniques for producing an electrical output signal corresponding to the vortex shedding frequency. The sensing element (1) comprises at least part of the signal arm (2) of an interferometer (3) which also includes means (12) for deriving a reference signal from the illuminating light source (4). The flow induced oscillation of the sensing element (1) caused by vortex shedding produces modulations of the interferometer output which is monitored by a photodetector (14) which, in turn, produces a modulated electrical output signal which can be processed by a signal processing system (16-19) to identify the vortex shedding frequency and, hence, produce a measurement of the flow velocity.