Abstract: An apparatus 115 for processing a substrate 20, comprises an integrated pumping system 155 having a high operating efficiency, small size, and low vibrational and noise levels. The apparatus 115 comprises a chamber, such as a load-lock chamber 110, transfer chamber 115, or process chamber 120. An integrated and local pump 165 is abutting or adjacent to one of the chambers 110, 115, 120 for evacuating gas from the chambers. The pump has an inlet 170 connected to a chamber 110, 115, 120, and an outlet 175 that exhausts the gas to atmospheric pressure. Preferably, the pump 165 comprises a pre-vacuum pump or a low vacuum pump.

Abstract: An apparatus 115 for processing a substrate 20, comprises an integrated pumping system 155 having a high operating efficiency, small size, and low vibrational and noise levels. The apparatus 115 comprises a chamber, such as a load-lock chamber 110, transfer chamber 115, or process chamber 120. An integrated pump 165 is abutting or adjacent to one of the chambers 110, 115, 120 for evacuating gas from the chambers. In operation, the pump is located within the actual envelope or footprint of the apparatus and has an inlet 170 connected to a chamber 110, 115, 120, and an outlet 175 that exhausts the gas to atmospheric pressure. Preferably, the integrated pump 165 comprises a pre-vacuum pump or a low vacuum pump and is housed in a noise reducing enclosure having means for moving the pump between locations and means for stacking pumps vertically in use.

Abstract: An apparatus 115 for processing a substrate 20, comprises an integrated pumping system 155 having a high operating efficiency, small size, and low vibrational and noise levels. The apparatus 115 comprises a chamber, such as a load-lock chamber 110, transfer chamber 115, or process chamber 120. An integrated pump 165 is abutting or adjacent to one of the chambers 110, 115, 120 for evacuating gas from the chambers. In operation, the pump is located within the actual envelope or footprint of the apparatus and has an inlet 170 connected to a chamber 110, 115, 120, and an outlet 175 that exhausts the gas to atmospheric pressure. Preferably, the integrated pump 165 comprises a pre-vacuum pump or a low vacuum pump and is housed in a noise reducing enclosure having means for moving the pump between locations and means for stacking pumps vertically in use.

Abstract: An apparatus 115 for processing a substrate 20, comprises an integrated pumping system 155 having a high operating efficiency, small size, and low vibrational and noise levels. The apparatus 115 comprises a chamber, such as a load-lock chamber 110, transfer chamber 115, or process chamber 120. An integrated pump 165 is abutting or adjacent to one of the chambers 110, 115, 120 for evacuating gas from the chambers. In operation, the pump is located within the actual envelope or footprint of the apparatus and has an inlet 170 connected to a chamber 110, 115, 120, and an outlet 175 that exhausts the gas to atmospheric pressure. Preferably, the integrated pump 165 comprises a pre-vacuum pump or a low vacuum pump and is housed in a noise reducing enclosure having means for moving the pump between locations and means for stacking pumps vertically in use.

Abstract: Generally, a vacuum pumping system having efficient power usage is provided. In one embodiment, the vacuum pumping system includes a first pump, a check valve and a second pump. The check valve and second pump are coupled in parallel to an exhaust line of the first pump. The first pump and second pump have a ratio of internal volume that is about 20 to about 130. In another embodiment, the vacuum pumping system includes a first pump, a check valve and a second pump. The check valve and second pump are coupled in parallel to an exhaust line of the first pump. The first pump and second pump have a ratio of power consumption that is about 5 to about 20. In yet another embodiment, the first pump and second pump have a ratio of pumping capacity that is about 50 to about 200.

Abstract: Generally, a vacuum pumping system having efficient power usage is provided. In one embodiment, the vacuum pumping system includes a first pump, a check valve and a second pump. The check valve and second pump are coupled in parallel to an exhaust line of the first pump. The first pump and second pump have a ratio of internal volume that is about 20 to about 130. In another embodiment, the vacuum pumping system includes a first pump, a check valve and a second pump. The check valve and second pump are coupled in parallel to an exhaust line of the first pump. The first pump and second pump have a ratio of power consumption that is about 5 to about 20. In yet another embodiment, the first pump and second pump have a ratio of pumping capacity that is about 50 to about 200.