Patents by Inventor Pedro Goncalo Carvalhais Teixeira Dias Jorge

Pedro Goncalo Carvalhais Teixeira Dias Jorge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120322124
    Abstract: A method for controlling growth of contaminant microorganisms in a fermentation process and in a fermentation system using a composition comprising (a) stabilized chlorine dioxide (SCD) and (b) a quaternary ammonium compound (QAC). The method comprises adding SCD and QAC to one or more steps of a fermentation process. In this method, the SCD and QAC may be added to one or more components of a fermentation broth comprising inoculant, fermentable sugar and process water.
    Type: Application
    Filed: December 19, 2011
    Publication date: December 20, 2012
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Derrick Otieno Okull, Ethan Baruch Solomon, Pedro Goncalo Carvalhais Teixeira Dias Jorge, Luiz Eduardo Biazi, Scott C. Glynn
  • Publication number: 20120308929
    Abstract: The invention is directed to a lamination fluid useful in processes for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The lamination system comprises 1) a dry film photoresist, 2) a laminate comprising i) copper ii) stainless steel iii) non metal on a surface, 3) a lamination fluid and 4) fluid application device on the laminates. The lamination fluid comprises water and a surface energy modification agent. The surface energy modification agent is present in a range between 0.0001 and 3.0 moles/liter, and the pH of the fluid is between 3 and 11.
    Type: Application
    Filed: August 13, 2012
    Publication date: December 6, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Shinji YU, Pedro Goncalo Carvalhais Teixeira Dias Jorge
  • Publication number: 20100037799
    Abstract: The invention is directed to a lamination fluid useful in processes for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The lamination system comprises 1) a dry film photoresist, 2) a laminate comprising i) copper ii) stainless steel iii) non metal on a surface, 3) a lamination fluid and 4) fluid application device on the laminates. The lamination fluid comprises water and a surface energy modification agent. The surface energy modification agent is present in a range between 0.0001 and 3.0 moles/liter, and the pH of the fluid is between 3 and 11.
    Type: Application
    Filed: October 30, 2009
    Publication date: February 18, 2010
    Applicant: E.I. du Pont de Nemours and Company
    Inventors: SHINJI YU, Pedro Goncalo Carvalhais Teixeira Dias Jorge