Patents by Inventor Pedro O. LOPEZ MONTESINOS

Pedro O. LOPEZ MONTESINOS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating baths of silver and tin alloys
    Patent number: 9512529
    Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: December 6, 2016
    Inventors: Adolphe Foyet, Margit Clauss, Wan Zhang-Beglinger, Julia Woertink, Yi Qin, Jonathan Prange, Pedro O Lopez Montesinos
  • PLATING BATH AND METHOD
    Publication number: 20150122661
    Abstract: Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS
  • PLATING BATH AND METHOD
    Publication number: 20150122662
    Abstract: Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS
  • ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS
    Publication number: 20140353162
    Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
    Type: Application
    Filed: June 4, 2013
    Publication date: December 4, 2014
    Inventors: Adolphe FOYET, Margit CLAUSS, Wan ZHANG-BEGLINGER, Julia WOERTINK, Yi QIN, Jonathan PRANGE, Pedro O. LOPEZ MONTESINOS