Patents by Inventor Peeradech Khunpukdee

Peeradech Khunpukdee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inter-connection of a lead frame with a passive component intermediate structure
    Patent number: 10727168
    Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: July 28, 2020
    Assignee: NXP B.V.
    Inventors: Bodin Kasemset, Peeradech Khunpukdee, Krassavan Tantirittisak
  • INTER-CONNECTION OF A LEAD FRAME WITH A PASSIVE COMPONENT INTERMEDIATE STRUCTURE
    Publication number: 20160079146
    Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 17, 2016
    Inventors: Bodin Kasemset, Peeradech Khunpukdee, Krassavan Tantirittisak
  • IC package with stainless steel leadframe
    Patent number: 8884415
    Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 11, 2014
    Assignee: NXP B.V.
    Inventors: Peeradech Khunpukdee, Bodin Kasemset, Ernst Eiper, Christian Zenz
  • IC PACKAGE WITH STAINLESS STEEL LEADFRAME
    Publication number: 20140239471
    Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: NXP B.V.
    Inventors: Peeradech Khunpukdee, Bodin Kasemset, Ernst Eiper, Christian Zenz