Abstract: Connector (1300) and printed circuit board combinations include opposing electrical ground structures that increase electrical coupling. The combinations also reduce unwanted crosstalk between signals in a printed circuit board.

Abstract: A connector system is disclosed that can include a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support signal terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are positioned on two sides of a pair of signal terminals and are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. The shield can include arms that electrically engage ground terminals.

Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

Abstract: A connector system is disclosed that can include a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support signal terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are positioned on two sides of a pair of signal terminals and are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. The shield can include arms that electrically engage ground terminals.

Abstract: A connector system is disclosed that can include a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. If desired, the ground terminal, the channel terminal and the shield can be electrically connected in the mating interface.

Abstract: A connector system includes a first housing, a second housing and a third housing. The first and second housings each include a wafer with signal terminals aligned in corresponding rows. The third housing mates to the first and second housings and supports a terminal array that connects the signal terminals in the first housings to the signal terminals in the second housing when the first and second wafer are arranged perpendicular to each other.

Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

Abstract: A connector system is disclosed that can include a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. If desired, the ground terminal, the channel terminal and the shield can be electrically connected in the mating interface.

Abstract: A connector system is disclosed that includes a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. If desired, the ground terminal, the channel terminal and the shield can be electrically connected in the mating interface.

Abstract: A connector system includes a first housing, a second housing and a third housing. The first and second housings each include a wafer with signal terminals aligned in corresponding rows. The third housing mates to the first and second housings and supports a terminal array that connects the signal terminals in the first housings to the signal terminals in the second housing when the first and second wafer are arranged perpendicular to each other.

Abstract: A connector system includes a first housing, a second housing and a third housing. The first and second housings each include a wafer with signal terminals aligned in corresponding rows. The third housing mates to the first and second housings and supports a terminal array that connects the signal terminals in the first housings to the signal terminals in the second housing when the first and second wafer are arranged perpendicular to each other.

Abstract: A connector system is disclosed that includes a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. If desired, the ground terminal, the channel terminal and the shield can be electrically connected in the mating interface.

Abstract: A connector system includes a first housing, a second housing and a third housing. The first and second housings each include a wafer with signal terminals aligned in corresponding rows. The third housing mates to the first and second housings and supports a terminal array that connects the signal terminals in the first housings to the signal terminals in the second housing when the first and second wafer are arranged perpendicular to each other.

Abstract: An adaptor includes a first and second recess that face in opposing directions and that are configured to receive a first and second connector. A floor in the adaptor can separate the first recess from the second recess. A pin array can be positioned in the floor and the pin array can extend in two directions from the floor so as to extend into the first and second recess. The pin array can include terminals that are configured with first and second contact ends that are respectively positioned in the first and second recess. The first and second contact ends can be respectively configured with a first and second orientation that are at a right angle with respect to each other.

Abstract: A high speed connector (106) with reduced crosstalk utilizes individual connector support frames (121, 122) that are assembled together to form a block of connector units (112). Each such unit supports a column of conductive terminals (113) in two spaced-apart columns. The columns have differential signal terminal pairs separated from each other by larger intervening ground shields that serve as ground terminals. The ground shields are arranged in alternating fashion within the pair of columns and they are closely spaced together so as to define within the pair of columns, a serpentine pattern of ground shields that cooperate to act as a single “pseudo” shield within each pair of columns. The ground shields are substantially larger in width (GW) than the differential signal terminal pairs (SPW) to provide more effective signal isolation.

Abstract: An adaptor includes a first and second recess that face in opposing directions and that are configured to receive a first and second connector. A floor in the adaptor can separate the first recess from the second recess. A pin array can be positioned in the floor and the pin array can extend in two directions from the floor so as to extend into the first and second recess. The pin array can include terminals that are configured with first and second contact ends that are respectively positioned in the first and second recess. The first and second contact ends can be respectively configured with a first and second orientation that are at a right angle with respect to each other.

Abstract: A high speed connector (106) with reduced crosstalk utilizes individual connector support frames (121, 122) that are assembled together to form a block of connector units (112). Each such unit supports a column of conductive terminals (113) in two spaced-apart columns. The columns have differential signal terminal pairs separated from each other by larger intervening ground shields that serve as ground terminals. The ground shields are arranged in alternating fashion within the pair of columns and they are closely spaced together so as to define within the pair of columns, a serpentine pattern of ground shields that cooperate to act as a single “pseudo” shield within each pair of columns. The ground shields are substantially larger in width (GW) than the differential signal terminal pairs (SPW) to provide more effective signal isolation.

Abstract: A high speed connector includes a plurality of wafer-style components, the wafers including two columns of conductive terminals that are supported in an insulative support body by a plurality of channels. Ribs may be provided to help secure one of the terminals in one of the plurality of channels. The two columns of terminals are configured to form broadside coupled terminal pairs and an air channel is at least partially disposed in the wafer between two adjacent broadside coupled terminal pairs.