Abstract: A thin-film semiconductor device comprising a substrate and a front contact layer disposed on said substrate including a plurality of segments separated by first scribe lines, a plurality of the segments forming a submodule, and at least one of the submodules forming a module. A bus is provided for interconnecting two or more of the submodules in parallel with each other. A thin film of a semiconductor material is disposed on the front contact layer and a back contact layer disposed on the thin film of semiconductor material. The back contact layer is scribed along second scribe lines corresponding to and adjacent the first scribe lines. An interconnection is provided for interconnecting adjacent areas of the rear and back contact layers.

Abstract: A solar cell module package having improved resistance to mechanical breakage and environmental stress has a layer of asphaltic material interposed between a support member and one or a plurality of solar cells affixed to a first support member. Resistance to environmental stress is further increased by including a barrier coating between the one or plurality of solar cells and the layer of asphaltic material. A method is provided for the preparation of the solar cell module package which includes interposing a layer of asphaltic material between a support member and one or a plurality of solar cells and curing the layer assembled with the module.