Abstract: A chemical vapor deposition process includes: performing a first-vapor deposition process to maintain a first temperature for a first time period; and performing a second-vapor deposition process, which includes: a temperature rising step, which makes the first temperature rise to a second temperature within a second time period; and a temperature dropping step, which makes the second temperature drop to a third temperature within a third time period.

Abstract: The method for labeling image objects is applied to a monitoring system that comprises a plurality of cameras, a first image analysis module and a plurality of second image analysis modules, wherein the plurality of cameras capture an image, having a background and at least one object, of a real environment, and the method comprises the steps of: (a) using the first image analysis module to frame and track the at least one object; (b) separating the framed object from the background; (c) classifying the object to one of the plurality of the second image analysis modules according to one initial feature of the object; (d) the plurality of second image analysis modules analyzing the initial feature in order to obtain an advance feature; and (e) labeling the object according to the advance feature.

Abstract: The present invention provides a method for tracking image objects, adopting at least one first camera and at least one second camera, wherein the first camera shoots a physical environment to obtain a first image, and the second camera shoots the physical environment to obtain a second image that partially overlaps the first image The method comprises the steps of: (a) merging the first image with the second image, in order to form a composite image; and (b) framing and tracking at least one object of the composite image.

Abstract: A semiconductor device includes semiconductor wires or sheets disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires or sheets, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires or sheets, a gate electrode layer disposed on the gate dielectric layer and wrapping around each channel region, and insulating spacers disposed in spaces, respectively. The spaces are defined by adjacent semiconductor wires or sheets, the gate electrode layer and the source/drain region. The source/drain epitaxial layer includes multiple doped SiGe layers having different Ge contents and at least one of the source/drain epitaxial layers is non-doped SiGe or Si.

Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.

Abstract: An example intent-recognition system comprises a processor and memory storing instructions. The instructions cause the processor to receive speech input comprising spoken words. The instructions cause the processor to generate text results based on the speech input and generate acoustic feature annotations based on the speech input. The instructions also cause the processor to apply an intent model to the text result and the acoustic feature annotations to recognize an intent based on the speech input. An example system for adapting an emotional text-to-speech model comprises a processor and memory. The memory stores instructions that cause the processor to receive training examples comprising speech input and receive labelling data comprising emotion information associated with the speech input. The instructions also cause the processor to extract audio signal vectors from the training examples and generate an emotion-adapted voice font model based on the audio signal vectors and the labelling data.

Abstract: A method includes depositing a first dielectric layer in an opening, the first dielectric layer comprising a semiconductor element and a non-semiconductor element. The method further includes depositing a semiconductor layer on the first dielectric layer, the semiconductor layer comprising a first element that is the same as the semiconductor element. The method further includes introducing a second element to the semiconductor layer wherein the second element is the same as the non-semiconductor element. The method further includes applying a thermal annealing process to the semiconductor layer to change the semiconductor layer into a second dielectric layer.

Abstract: A modified carbon material, including a carbonaceous material and a water-insoluble modifier combined with the carbonaceous material, wherein the water-insoluble modifier is CuO, the carbonaceous material is one of or a mixture of biomass carbon or carbon black, a mass of the water-insoluble modifier is being 0.1-10 wt % of the carbonaceous material. The method for preparing the modified carbon material includes: (1) soaking the carbonaceous material in a copper sulfate solution for 5 to 36 hours, and (2) adding an alkali solution into a solution obtained in step (1) to provide a pH value ?12, and after keeping the pH value for 0.5 to 2 hours, filtering and drying to obtain a solid. (3) using the carbonaceous material as a combustion heat source to reduce the ignition temperature, increase or reduce the peak thermal power temperature.

Abstract: A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first conductive via extended through the first substrate; a second conductive via extended through the first substrate; and a third conductive via extended through the first substrate, wherein the second conductive via is disposed between the first conductive via and the third conductive via, the second conductive via is configured to connect to a signal source, and the first conductive via and the third conductive via are configured to connect to an electrical ground.

Abstract: A mask container for storing a mask for photolithography, includes a cover and a base having a plurality of tapered corners. The tapered corners taper outward and downward from a top major surface of the base. The cover having the tapered corners extends downward that covers the tapered corners of the base when the cover is attached to the base. The tapered corners of the cover are tapered at about the same angle as the tapered corners of the base so that a surface of the tapered corners of the cover is substantially parallel to a corresponding surface of the tapered corner of the base when the cover is attached to the base. A recess is located in the tapered corners of the cover. A biasing member and a ball-shaped member are located in the tapered corners of the base to mate with the recess when the cover is attached to the base.

Abstract: According to a first aspect, there is provided a method for enabling a communication link over which transaction data is transmitted between a mobile terminal and a receiving terminal, the method comprising: storing in a memory at the mobile terminal, the receiving terminal and a server administering the communication link, a generated unique identifier, the unique identifier used to facilitate the enablement of the communication link; creating a storage slot at the server administering the communication link, the storage slot being assigned the unique identifier and the storage slot used to store the transaction data; and enabling the communication link in response to the creation of the storage slot, wherein the communication link is utilised by both the mobile terminal and the receiving terminal by referencing the unique identifier to the server.

Abstract: System and methods for optimizing flow distribution across multiple production zones are provided. A flow distribution is assigned to a plurality of production zones along a wellbore within a formation. A temperature value is estimated for each of the production zones, based on the assigned flow distribution. The estimated temperature value is compared with an actual temperature value determined for each production zone. An error amount for the estimated temperature value is calculated based on the comparison. Based on the error amount, it is determined whether or not the flow distribution has reached a global optimum. The assigning, the estimating, the comparing, the calculating, and the determining are repeated until it is determined that the flow distribution assigned to the plurality of production zones has reached the global optimum.

Abstract: The present disclosure provides a power supply socket and a power receiving head. The socket includes a power supply socket housing, a conductive member, a switching element, and a control component. The conductive member is provided in the power supply socket housing and can be connected to a conductive portion on a power receiving head. The switching element is provided in the housing and has an output end and a control end, the output end of the switching element is connected to the conductive member. The control component is provided in the housing and connected to the control end of the switching element, and is configured to detect the power receiving head, and control the switching element to be turned on when the power receiving head is detected, and control the switching element to be turned off when the power receiving head is not detected.

Abstract: An attachment configured for use with a food processing system includes a container configurable with a food processing base of the food processing system. The container has a processing chamber. The processing chamber has a first configuration adjacent a first end of said container and a distinct second configuration adjacent a second end of said container, said second configuration being circular.

Abstract: A method for manufacturing a semiconductor device includes preparing a first group of wafers having a plurality of first semiconductor dies embedded in a first photosensitive material layer; forming a plurality of first through vias in the first photosensitive material layer; attaching at least two of the first group of wafers using a first adhesive layer to form a first structure; preparing a second group of wafers having a plurality of second semiconductor dies embedded in a second photosensitive material layer; forming a plurality of second through vias in the second photosensitive material layer; attaching at least two of the second group of wafers using a second adhesive layer to form a second structure; and connecting the first structure to the second structure with a plurality of first metal bumps.

Abstract: A biocompatible Mg—P coating on the surface of a zinc-based biomedical material, and a preparation method and use thereof are disclosed. In the method, zinc and a zinc alloy are first subjected to surface pretreatment and then soaked in a phosphate solution at a constant temperature to form the Mg—P coating through chemical liquid deposition (CLD). The control on the composition, thickness and surface morphology of the coating is realized by using the CLD method. The biocompatible Mg—P coating has a thickness of 0.5 ?m to 50 ?m, is dense and uniform, and comprises a main component of zinc-magnesium-phosphate and a small amount of zinc phosphate.

Abstract: The present disclosure describes a semiconductor structure that includes a channel region, a source region adjacent to the channel region, a drain region, a drift region adjacent to the drain region, and a dual gate structure. The dual gate structure includes a first gate structure over portions of the channel region and portions of the drift region. The dual gate structure also includes a second gate structure over the drift region.

Abstract: Techniques are described for pooling data originating from different entities into a data pool managed by a data pool management system for performing accurate and resource-efficient statistical and other data operations by entities. Techniques further include maintaining rule sets that govern access to the data sets of the data pool. The DPMS uses the rule sets to determine whether a particular data set, on which a particular operation is requested to be performed, qualifies as authorized data for the requesting entity. In an embodiment, the DPMS determines, based on one rule set, that the particular data set does not qualify as authorized data for the particular operation. The DPMS further determines that based on another rule set the particular data set does qualify as authorized data for the particular operation. Based on determining that authorizing rule set overrides the non-authorizing rule set, DPMS proceeds to performing the particular operation using the particular data set.

Abstract: A fan frame structure includes a frame having a bottom surface, a top surface and a flow passage. The flow passage is located between the bottom surface and the top surface, and the bottom surface and the top surface are provided with an outlet opening and an inlet opening, respectively, which are communicable with the flow passage. The outlet opening has an outlet edge, on and along which a plurality of notches communicable with the flow passage is cut. By providing the notches on the outlet edge, it is able to largely reduce the noise and the vibration produced when a fan operates.

Abstract: A pellicle includes a frame configured to attach to a photomask, wherein the frame includes a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly connects to an outer surface of the frame. The pellicle further includes a membrane extending over a top surface of the frame. The pellicle further includes a mount between the frame and the membrane, wherein the mount is attachable to the frame by an adhesive.