Patents by Inventor Pei-Chang Huang

Pei-Chang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10379421
    Abstract: A method and system for utilizing the laser defocusing effect for phase matching of high order harmonic generation in a tight focusing geometry are provided. The most suitable focusing geometry, especially those five parameters including: (1) the aperture size of the adjustable iris, (2) the focus position with respect to the gas cell, (3) the backing pressure of the gas cell, (4) the focal length and (5) the length of the gas cell, for achieving phase matching of the target harmonic order and maximal yield of the target harmonic order are disclosed.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: August 13, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Ming-Chang Chen, Hung-Wei Sun, Pei-Chi Huang
  • Publication number: 20190181135
    Abstract: A control circuit providing an output voltage and including an N-type transistor, a first P-type transistor and a second P-type transistor is provided. The N-type transistor is coupled to a first power terminal. The first P-type transistor includes a first source, a first drain, a first gate and a first bulk. The first gate is coupled to a gate of the N-type transistor. The first bulk is coupled to the first source. The second P-type transistor includes a second source, a second drain, a second gate and a second bulk. The second source is coupled to a second power terminal. The second drain and the second bulk are coupled to the first bulk.
    Type: Application
    Filed: December 12, 2017
    Publication date: June 13, 2019
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang HUANG, Shang-Chuan PAI, Wei-Chung WU, Szu-Chi CHEN, Sheng-Chih CHUANG, Yin-Ting LIN, Pei-Chun YU, Han-Pei LIU, Jung-Tsun CHUANG, Chieh-Yao CHUANG, Hung-Wei CHEN
  • Patent number: 10319719
    Abstract: A semiconductor device includes a first a first transistor configured to operate at a first threshold voltage level. The first transistor includes a first gate structure and a first drain terminal electrically coupled to the first gate structure. The semiconductor device also includes a second transistor configured to operate at a second threshold voltage level different from the first threshold voltage level. The second transistor includes a second source terminal and a second gate structure electrically coupled to the first gate structure. The first gate structure and the second gate structure comprise a first component in common, and the second gate structure further includes at least one extra component disposed over the first component. The number of the at least one extra component is determined by a desired voltage difference between the first threshold voltage level and the second threshold voltage level.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: June 11, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Chen-Yi Lee, Shih-Fen Huang, Pei-Lun Wang, Dah-Chuen Ho, Yu-Chang Jong, Mohammad Al-Shyoukh, Alexander Kalnitsky
  • Publication number: 20190155125
    Abstract: A method and system for utilizing the laser defocusing effect for phase matching of high order harmonic generation in a tight focusing geometry are provided. The most suitable focusing geometry, especially those five parameters including: (1) the aperture size of the adjustable iris, (2) the focus position with respect to the gas cell, (3) the backing pressure of the gas cell, (4) the focal length and (5) the length of the gas cell, for achieving phase matching of the target harmonic order and maximal yield of the target harmonic order are disclosed.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 23, 2019
    Inventors: Ming-Chang CHEN, Hung-Wei SUN, Pei-Chi HUANG
  • Patent number: 9739963
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: August 22, 2017
    Assignee: Unimicron Technology Corp.
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Publication number: 20170129454
    Abstract: A safety system for preventing a living body from being locked in a vehicle comprises a warning unit, a detection device and a limiting device. The detection device is disposed in a passenger's protection device which has to be used by a passenger when the vehicle is being driven. The detection device detects whether the passenger's protection device is in use or not to generate a corresponding detection signal. The warning unit turns on or turns off a warning device according to the detection signal and generates a corresponding control signal. The limiting device locks the vehicle key in the key slot or to release the vehicle key from the key slot according to the control signal after the vehicle has been parked.
    Type: Application
    Filed: November 10, 2015
    Publication date: May 11, 2017
    Inventors: Pei-Chang HUANG, Cheng-Po YU
  • Patent number: 9581774
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: February 28, 2017
    Assignee: Unimicron Technology Corp.
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Publication number: 20160266334
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 15, 2016
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Publication number: 20160252689
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Application
    Filed: May 12, 2016
    Publication date: September 1, 2016
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Patent number: 9377596
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 28, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Patent number: 9335470
    Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 10, 2016
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Publication number: 20160097130
    Abstract: A preparation method of a conductive sponge includes the following steps. First, a sponge substrate is dipped in a metal solution and then taken out. A first drying process is performed. Next, the sponge substrate plated with metal particles is dipped in a carbon nanomaterial suspension and then taken out. Then, a second drying process is performed.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 7, 2016
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Patent number: 9288917
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 15, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20160025944
    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 28, 2016
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Publication number: 20150362674
    Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.
    Type: Application
    Filed: September 19, 2014
    Publication date: December 17, 2015
    Inventors: Yin-Ju CHEN, Cheng-Po YU, Pei-Chang HUANG
  • Patent number: 9198303
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: November 24, 2015
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang, Ai-Hwa Lim
  • Patent number: 9159713
    Abstract: An opto-electronic circuit board includes a substrate, a cavity, blind vias, metal layers, a first chip, a second chip, and the optical component. The substrate includes a first circuit layer, a second circuit layer, and a dielectric layer disposed between the first circuit layer and the second circuit layer. The cavity is disposed on the dielectric layer, in which the cavity extends from the first circuit layer to the second circuit layer. The blind vias are disposed at opposite sides of the cavity. The first chip is disposed on the second circuit layer with corresponding to one of the blind vias. The second chip is disposed on the second circuit layer with corresponding to the other one of the blind vias. The optical component is disposed in the cavity, in which the second surface of the optical component is connected to the first circuit layer.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: October 13, 2015
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Yin-Ju Chen, Cheng-Po Yu, Pei-Chang Huang
  • Patent number: 9095083
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: July 28, 2015
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20150121694
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20150121693
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang, Ai-Hwa Lim