Patents by Inventor Pei-Chi Chen
Pei-Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11965852Abstract: A microelectromechanical sensor includes a base, a heater provided on the base, and a sensing electrode including a sensing portion. The heater includes a heating portion. The heater and the sensing electrode are provided at different layers in a stacking direction, and the sensing electrode is electrically insulated from the heater. On a reference plane in the stacking direction, a projection of the sensing portion of the sensing electrode is entirely covered by a projection of the heating portion of the heater.Type: GrantFiled: April 12, 2022Date of Patent: April 23, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pei-Chi Kuo, Bor-Shiun Lee, Ming-Fa Chen
-
Patent number: 11925454Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.Type: GrantFiled: October 5, 2020Date of Patent: March 12, 2024Inventors: Chia-Chi Su, Hsiao-Pao Yen, Pei-Ling Hsu, Chia-Hung Chen
-
Patent number: 11764120Abstract: A chip packaging structure includes a chip, a redistribution layer, a solder ball, an encapsulant, and a stress buffer layer. The chip has an active surface and a back surface opposite to each other, and a peripheral surface connected to the active surface and the back surface. The redistribution layer is disposed on the active surface of the chip. The solder ball is disposed on the redistribution layer, and the chip is electrically connected to the solder ball through the redistribution layer. The encapsulant encapsulates the active surface and the back surface of the chip, the redistribution layer, and part of the solder ball. The stress buffer layer at least covers the peripheral surface of the chip. An outer surface of the stress buffer layer is aligned with a side surface of the encapsulant.Type: GrantFiled: January 22, 2021Date of Patent: September 19, 2023Assignee: Unimicron Technology Corp.Inventors: Kai-Ming Yang, Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko
-
Publication number: 20230178534Abstract: This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.Type: ApplicationFiled: November 18, 2022Publication date: June 8, 2023Applicant: Innolux CorporationInventors: Jia-Sin Lin, Wen-Chi Fang, Jen-Hai Chi, Zhi-Fu Huang, Pei-Chi Chen, Wan-Chun Tsai
-
Publication number: 20230171896Abstract: A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.Type: ApplicationFiled: October 30, 2022Publication date: June 1, 2023Applicant: Innolux CorporationInventors: Pei-Chi Chen, Wen-Chi Fang, Jen-Hai Chi, Zhi-Fu Huang, Jia-Sin Lin, Wan-Chun Tsai
-
Publication number: 20220208630Abstract: A chip packaging structure includes a chip, a redistribution layer, a solder ball, an encapsulant, and a stress buffer layer. The chip has an active surface and a back surface opposite to each other, and a peripheral surface connected to the active surface and the back surface. The redistribution layer is disposed on the active surface of the chip. The solder ball is disposed on the redistribution layer, and the chip is electrically connected to the solder ball through the redistribution layer. The encapsulant encapsulates the active surface and the back surface of the chip, the redistribution layer, and part of the solder ball. The stress buffer layer at least covers the peripheral surface of the chip. An outer surface of the stress buffer layer is aligned with a side surface of the encapsulant.Type: ApplicationFiled: January 22, 2021Publication date: June 30, 2022Applicant: Unimicron Technology Corp.Inventors: Kai-Ming Yang, Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko
-
Patent number: 11217884Abstract: A radiation device includes: a first substrate; a second substrate; a dielectric layer disposed between the first substrate and the second substrate; and a film layer structure disposed on the first substrate. The resistivity of the film layer structure is between 108 and 5×1014 ?-cm. Therefore, frequency modulation range of radiation signals of the radiation device can be increased.Type: GrantFiled: June 18, 2020Date of Patent: January 4, 2022Assignee: INNOLUX CORPORATIONInventors: Hang-Lang Lee, I-Yin Li, Tang-Chin Hung, Pei-Chi Chen
-
Publication number: 20210021023Abstract: A radiation device includes: a first substrate; a second substrate; a dielectric layer disposed between the first substrate and the second substrate; and a film layer structure disposed on the first substrate. The resistivity of the film layer structure is between 108 and 5×1014 ?-cm. Therefore, frequency modulation range of radiation signals of the radiation device can be increased.Type: ApplicationFiled: June 18, 2020Publication date: January 21, 2021Inventors: Hang-Lang LEE, I-Yin LI, Tang-Chin HUNG, Pei-Chi CHEN
-
Patent number: 10242963Abstract: Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release treatment is performed to isolate the polymer substrate from the cavity. A plurality of conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.Type: GrantFiled: April 13, 2016Date of Patent: March 26, 2019Assignee: National Tsing Hua UniversityInventors: Yu-Lin Wang, Chen-Pin Hsu, Pei-Chi Chen
-
Publication number: 20170248590Abstract: Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release treatment is performed to isolate the polymer substrate from the cavity. A plurality of conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.Type: ApplicationFiled: April 13, 2016Publication date: August 31, 2017Inventors: Yu-Lin Wang, Chen-Pin Hsu, Pei-Chi Chen
-
Patent number: 7551684Abstract: A wireless communication system includes an antenna, a receiving module, a power source, and a power control hub. The power control hub includes an amplifier having a first end coupled to the receiving module and a second end coupled to the power source. The amplifier generates a first output signal based on a control signal of the receiving module. The power control hub includes a rectifier having a first end coupled to the output end of the amplifier and a second end coupled to the power source. The rectifier generates a second output signal based on the first output signal. The power control hub also includes a switch. A first and a second end of the switch are electrically connected or disconnected based on the second output signal received at a control end of the switch.Type: GrantFiled: March 20, 2006Date of Patent: June 23, 2009Assignee: Wistron NeWeb CorporationInventors: Chen-Chia Huang, Cheng-Hsiung Hsu, Chun-Chao Chen, Kuo-Lung Lin, Pei-Chi Chen
-
Publication number: 20070189413Abstract: A wireless communication system includes an antenna, a receiving module, a power source, and a power control hub. The power control hub includes an amplifier having a first end coupled to the receiving module and a second end coupled to the power source. The amplifier generates a first output signal based on a control signal of the receiving module. The power control hub includes a rectifier having a first end coupled to the output end of the amplifier and a second end coupled to the power source. The rectifier generates a second output signal based on the first output signal. The power control hub also includes a switch. A first and a second end of the switch are electrically connected or disconnected based on the second output signal received at a control end of the switch.Type: ApplicationFiled: March 20, 2006Publication date: August 16, 2007Inventors: Chen-Chia Huang, Cheng-Hsiung Hsu, Chun-Chao Chen, Kuo-Lung Lin, Pei-Chi Chen