Patents by Inventor Pei-Chi Lin

Pei-Chi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contact sensor package structure
    Patent number: 7122757
    Abstract: A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: October 17, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chang Lee, Cheng-Yin Lee, Yung-Li Lu, Ying-Tsai Yeh, Pei-Chi Lin
  • Contact sensor package structure
    Publication number: 20050274597
    Abstract: A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 15, 2005
    Inventors: Shih-Chang Lee, Cheng-Yin Lee, Yung-Li Lu, Ying-Tsai Yeh, Pei-Chi Lin