Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: An assembly that is removably mountable to a wall, the assembly including a base plate and a mounting plate that is asymmetrically deflectably coupled to the base plate.

Abstract: An assembly that is removably mountable to a wall, the assembly including a base plate and a mounting plate that is asymmetrically deflectably coupled to the base plate.

Abstract: The present disclosure relates to a silicone resin composition comprising a silicone resin having at least one terminal hydrogen group, a metal alkoxide having at least one C1-6 ailcoxy group, and a silane having at least one terminal vinyl group and at least one terminal C1-6 alkoxy or hydroxyl group. The composition cured has a refractive index greater than 1.4. The present disclosure also relates to an optoelectronic device, which is encapsulated with the aforementioned composition.