Abstract: A stirring device includes a stirring unit, a gas supplying unit, and a feeding unit. The stirring unit includes a drive mechanism and a shaft member. The shaft member includes a hollow rotary shaft coupled to be driven by the drive mechanism to rotate, and a stirring head coupled to rotate with the hollow rotary shaft. The gas supplying unit includes a gas supply, and a piping member fluidly communicating with the gas supply and the shaft member. The feeding unit includes a storage tank and a feeding tube fluidly communicating with the storage tank and the shaft member.

Abstract: A stirring device includes a stirring unit, a gas supplying unit, and a feeding unit. The stirring unit includes a drive mechanism and a shaft member. The shaft member includes a hollow rotary shaft coupled to be driven by the drive mechanism to rotate, and a stirring head coupled to rotate with the hollow rotary shaft. The gas supplying unit includes a gas supply, and a piping member fluidly communicating with the (gas supply and the shaft member. The feeding unit includes a storage tank and a feeding tube fluidly communicating with the storage tank and the shaft member.

Abstract: A method and an apparatus for recycling magnesium alloy cuttings are provided. A structure of the apparatus includes: a smelting furnace, configured to hold molten magnesium, where the smelting furnace is segmented into a refining chamber and a molten metal tapping chamber in communication with each other; a mixing unit, rotatably disposed in the refining chamber, and configured to generate a sinking whirlpool toward a bottom of the smelting furnace during rotation; and a waste material treatment unit, including a feeding module, where the feeding module includes a material rod capable of continuously rotating and a material channel in communication with the refining chamber, the material rod is configured to drive magnesium cuttings to enter the refining chamber through the material channel, and the material channel is configured to feed a protective gas.

Abstract: A method of manufacturing a charging capacity structure includes steps of: forming a first oxide layer, a support layer and a second oxide layer on a substrate in sequence; forming a plurality of etching holes on the surface of the second oxide layer in a matrix to run through the substrate that are spaced from each other at a selected distance; forming a plurality of pillar layers in the etching holes; removing the second oxide layer by etching; forming an etching protection layer on the surfaces of the support layer and pillar tubes that is formed at a thickness one half of the spaced distance between the etching holes such that the pillar tubes at diagonal locations form a self-calibration hole; and finally removing the first oxide layer from the self-calibration hole by etching. Through the self-calibration hole, the invention needn't to provide extra photoresists to form holes.

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

Abstract: A method of manufacturing a charging capacity structure includes steps of: forming a first oxide layer, a support layer and a second oxide layer on a substrate in sequence; forming a plurality of etching holes on the surface of the second oxide layer in a matrix to run through the substrate that are spaced from each other at a selected distance; forming a plurality of pillar layers in the etching holes; removing the second oxide layer by etching; forming an etching protection layer on the surfaces of the support layer and pillar tubes that is formed at a thickness one half of the spaced distance between the etching holes such that the pillar tubes at diagonal locations form a self-calibration hole; and finally removing the first oxide layer from the self-calibration hole by etching. Through the self-calibration hole, the invention needn't to provide extra photoresists to form holes.

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.