Patents by Inventor Pei-Chun Ko

Pei-Chun Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air duct and heat dissipation device having the same
    Patent number: 9217611
    Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: December 22, 2015
    Assignee: ShenZhen Treasure City Technology Co., LTD.
    Inventors: Ching-Jou Chen, Wen-Chieh Wang, Chih-Sheng Hsieh, Pei-Chun Ko, Gin-Zen Ting, Wei-De Wang, Chung-Jen Hung
  • AIR DUCT AND HEAT DISSIPATION DEVICE HAVING THE SAME
    Publication number: 20140166247
    Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHING-JOU CHEN, WEN-CHIEH WANG, CHIH-SHENG HSIEH, PEI-CHUN KO, GIN-ZEN TING, WEI-DE WANG, CHUNG-JEN HUNG
  • HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION MODULE
    Publication number: 20130248161
    Abstract: A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes.
    Type: Application
    Filed: June 29, 2012
    Publication date: September 26, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: PEI-CHUN KO, CHUN-SHENG YU, WEI-DE WANG, CHIH-SHENG HSIEH, CHUNG-JEN HUNG, GIN-ZEN TING, WEN-CHIEH WANG
  • Structure of a light and sign assembly for showing the direction of an emergency exit
    Patent number: D525894
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: August 1, 2006
    Assignee: Longsun Technologies Co., Ltd.
    Inventors: Liang-Chieh Chiang, Pei-Chun Ko, Wan-Jung Wu, Wen-Shou Wang, Yu-Pin Kao, Jack C. Chu