Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.

Abstract: A touch panel includes a substrate, a plurality of electrodes arranged on the substrate for transmitting a plurality of driving signals and generating a plurality of sensing signals according to the plurality of driving signals, and a driving element. The driving element is for driving the plurality of electrodes, wherein the driving element is disabled within a predetermined period following transition of a common voltage of a display panel.

Abstract: A touch panel comprising a substrate, a touch element, a first grounding electrode, an insulation layer and a second grounding electrode is disclosed. The touch element is disposed on a first surface of the substrate. The first grounding electrode is disposed on the first surface to surround the touch element. The insulation layer is disposed on the first surface to cover the touch element and the first grounding electrode. The second grounding electrode is disposed on the first insulation layer or on a second surface of the substrate opposite to the first surface. Therefore, the ESD can be conducted to the grounding end G of the circuit component through the enclosed first grounding electrode, and the signal interference between the touch panel and display can be shielded by the second grounding electrode to enhance anti-ESD and anti-noise abilities of the touch panel.

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract: A series of conjugated polymers with electrochromic properties and photovoltaic activity are provided. The representative structure formula of the conjugated polymers is shown as structure formula (I): Wherein m can be 1-4, p can be 0-3, and n can be 3-10000; R1 and R2 can be —H, —CaH2a+1, —OCaH2a+1, —SCaH2a+1, —N(CaH2a+1)2 or —[O(CaH2a)2]b (a=1-15, b=1-5), respectively; and X is an unsaturated moiety.