Patents by Inventor Pei-Han Liu

Pei-Han Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
    Publication number: 20220081514
    Abstract: A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by a reaction between a diamine compound having a nonpolar backbone structure and maleic anhydride, and a molecular structure thereof contains a greater amount of non-polar and hydrophobic groups.
    Type: Application
    Filed: July 19, 2021
    Publication date: March 17, 2022
    Inventors: TE-CHAO LIAO, SEN-HUANG HSU, Pei-Han Liu