Patents by Inventor Pei-Heng Lin

Pei-Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Impedance-type chip for real-time sensing sweat pressure and method thereof
    Patent number: 11832957
    Abstract: An impedance-type chip for real-time sensing sweat pressure, a micro-control system, and method thereof are provided for monitoring a physiological state of a subject. The impedance-type chip includes a substrate, a pair of comb-shaped electrodes, a first double-layered junction plate, a microfluidic channel plate, a second double-layered junction plate, and a sealing plate. Each the comb-shaped electrodes has a plurality of sub-electrodes and is disposed on the substrate to provide different impedance values. The first double-layered junction plate is disposed on the substrate, the microfluidic channel plate is disposed on the first double-layered junction plates, and the second double-layered junction plate is disposed on the microfluidic channel plate, wherein the first double-layered junction plate, the microfluidic channel plate, and the second double-layered junction plate have a microfluidic channel with a cavity.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: December 5, 2023
    Assignee: National Yang Ming Chiao Tung University
    Inventors: Bor-Ran Li, Pei-Heng Lin, Wei-Lung Chang, Sian-Chen Sheu
  • IMPEDANCE-TYPE CHIP FOR REAL-TIME SENSING SWEAT PRESSURE AND METHOD THEREOF
    Publication number: 20220304618
    Abstract: An impedance-type chip for real-time sensing sweat pressure, a micro-control system, and method thereof are provided for monitoring a physiological state of a subject. The impedance-type chip includes a substrate, a pair of comb-shaped electrodes, a first double-layered junction plate, a microfluidic channel plate, a second double-layered junction plate, and a sealing plate. Each the comb-shaped electrodes has a plurality of sub-electrodes and is disposed on the substrate to provide different impedance values. The first double-layered junction plate is disposed on the substrate, the microfluidic channel plate is disposed on the first double-layered junction plates, and the second double-layered junction plate is disposed on the microfluidic channel plate, wherein the first double-layered junction plate, the microfluidic channel plate, and the second double-layered junction plate have a microfluidic channel with a cavity.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 29, 2022
    Inventors: Bor-Ran Li, Pei-Heng Lin, Wei-Lung Chang, Sian-Chen Sheu