Patents by Inventor Pei Hou

Pei Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050124183
    Abstract: A land grid array (LGA) socket is adapted to receive an IC module (40) and mounted on a PCB (50). The socket (1) includes an insulative housing (30) having a plurality of passageways (302) and a plurality of electrical terminals (10) received in the passageways. Each of the terminals includes a retention portion (12), a pressing arm (16) bent slantwise and extending upwardly from an end of the retention portion, and a contacting arm (18) bent slantwise and extending downwardly from another end of the retention portion. At least one connecting plate (14) connects the pressing arm and the contacting arm, the connecting plate disconnects the retention portion, thereby decreasing impedance of the terminal.
    Type: Application
    Filed: November 30, 2004
    Publication date: June 9, 2005
    Inventor: Sung-Pei Hou
  • Publication number: 20050083659
    Abstract: The socket connector assembly (20) comprises a socket connector (30), an IC package (40) installed upon the socket connector, a heat sink (60) mounted above the IC package, an actuator (50, 50?) detachably attached to the socket connector, a retention mechanism (70) mounted on the actuator and securing the heat sink on the actuator, and at least one latch (51, 51?). Said at least one latch comprises a body (51a, 51a?). One end (51c) of the body is disposed on a part of the actuator. A latching portion (51b, 51b?) is formed on another end of the body, for being directly attached to a part of the socket connector. Thereby said at least one latch holds the actuator on the socket connector.
    Type: Application
    Filed: October 21, 2003
    Publication date: April 21, 2005
    Inventors: Andrew Gattuso, Sung-Pei Hou
  • Patent number: 6881088
    Abstract: A connector assembly (10) includes a test connector (14) for testing of an IC package (40), an actuation system (12) mounted on the test connector, and a supporting member (16) engaged with the actuation system. The supporting member includes a frame (162) and a plurality of columns (160) for supporting the frame. The frame defines an opening (1620) in a center thereof, a pair of opposite channels (1622), and two receiving holes (1623). The actuation system includes a pair of first cams (120) received in the corresponding channels of the frame, a pair of spindles (126) received in the corresponding receiving holes of the frame, an actuation lever (124) connected between the first cams, and a pair of second cams (122) integrally connected to the spindles. The actuation system can exert a continuous force on the test connector, thereby the testing of the IC package is effective.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: April 19, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Andrew Gattuso, Sung Pei Hou, Jung-Jang Chu, Hsiu-Yuan Hsu
  • Publication number: 20050068753
    Abstract: An IC socket (10) includes an insulative housing (12) mounted on a burn-in board, a plurality of conductive contacts (14) received in the housing. The housing defines a recessed area (120) bounded by two pairs of sidewalls (122), the recessed area defining a plurality of passageways therein. One of the sidewalls fabricates a receiving channel (1220) substantially parallel to an upper surface of the recessed area and a fastening channel (1222) substantially perpendicularly communicating with the receiving channel. A bolt (16) is screwed in the fastening channel. When the IC socket is used, a sensor (20) is received in the receiving channel and restricted in the proper position by the bolt screwed in the fastening channel.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 31, 2005
    Inventors: Robert McHugh, Sung-Pei Hou
  • Publication number: 20050048811
    Abstract: An electrical connector assembly includes a first connector (2), a second connector (4) and a transfer member (3). The first connector has a first housing (20) and a number of first contacts (21) received in the first housing. An Integrated Circuit chip (not shown) electrically connects with the first contacts. The second connector has a second housing (40) and a number of second contacts (41) received in the second housing. The transfer member is disposed between the first connector and the second connector. The transfer member includes a first interface (30) and a second interface (31). The first interface is formed with a number of first conductive portions (300) connecting the first contacts. The second interface provides a number of second conductive portions (301) electrically connecting the second contacts.
    Type: Application
    Filed: August 30, 2004
    Publication date: March 3, 2005
    Inventors: Yao-Chi Huang, Sung-Pei Hou
  • Publication number: 20050012516
    Abstract: A burn-in socket (1) includes a base (10) receiving an IC and a number of contacts (12) received in the base, and a pressing member (14). The base defines a slot (1024) in a wall thereof and having a step (1029) under the slot. A bore (1026) is defined in and through the wall in a lateral direction. The pressing member included an elongated lever (144) and a pair of screws (140) for securing the lever on the wall. A sensor is received in the bore and sandwiched by the lever and the step to provide signals to a controller during being operated at a high temperature. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.
    Type: Application
    Filed: July 19, 2004
    Publication date: January 20, 2005
    Inventor: Sung-Pei Hou
  • Patent number: 6832918
    Abstract: An integrated circuit (IC) socket assembly (1) includes an insulative housing (11), a holding component (12) and a multiplicity of electrical terminals (13). Each of the terminals includes a head portion (135) forming a first contact portion (131) at a free end thereof for electrically contacting an IC (2), a holding portion (133) engaging the terminal in the holding component, and a second contact portion (132) for electrically contacting a burn-in board (3) by Through Hole technology. Some of the terminals further include connecting portions (134) each bending from ends of the holding portions to ends of the second contact portions. Each of the connecting portions has a desired length in a horizontal direction, to decreases the difficulty of making the holes in the burn-in board and assembling the second contact portions into the burn-in board by Through Hole technology.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 21, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Sung-Pei Hou
  • Patent number: 6821138
    Abstract: A socket connector (1) includes a base (10) defining an array of terminal cells (111), a number of conductive contacts (30) received in the respective terminal cells, a cover (20) slidably mounted on the base and a driving device (40) sandwiched between the cover and the base for driving the cover to move relative to the base. The cover has a supporting surface (211) for supporting a CPU (5) and defines an array of pin holes (213) corresponding to the terminal cells for insertion of pins (51) of the CPU therethrough. A standoff is formed on each of peripheral edges of the supporting surface, and a number of small-dimensioned supporting posts (222) and large-dimensioned supporting posts (223) are formed on the supporting surface within the outline positions of the standoffs for supporting the CPU mounted on the socket connector. The standoff and the supporting posts have the same height.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: November 23, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Sung-Pei Hou
  • Patent number: 6814602
    Abstract: A test connector (10) includes a connector body (30) with terminals therein, a lid (20), four guiding mechanisms (50), and two pressing mechanisms (40). The connector body comprises an outer housing (34) and an inner housing (32) for receiving an IC package (80). Each pressing mechanism comprises a first shaft (44) attached to the lid, a second shaft (46) mounted to the outer housing, two operating levers (42) engaged between the first and second shafts, and a leaf spring (48) mounted to the first shaft. When the lid is in an upper position, the pressing mechanisms are in a first position in which the leaf springs are disengaged from the IC package, while when the lid is in a lower position, the pressing mechanisms are moved to a second position in which the leaf springs are engaged with the IC package thereby the IC package can be tested.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: November 9, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Andrew Gattuso, Sung-Pei Hou
  • Publication number: 20040219816
    Abstract: An integrated circuit (IC) socket assembly (1) includes an insulative housing (11), a holding component (12) and a multiplicity of electrical terminals (13). Each of the terminals includes a head portion (135) forming a first contact portion (131) at a free end thereof for electrically contacting an IC (2), a holding portion (133) engaging the terminal in the holding component, and a second contact portion (132) for electrically contacting a burn-in board (3) by Through Hole technology. Some of the terminals further include connecting portions (134) each bending from ends of the holding portions to ends of the second contact portions. Each of the connecting portions has a desired length in a horizontal direction, to decreases the difficulty of making the holes in the burn-in board and assembling the second contact portions into the burn-in board by Through Hole technology.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 4, 2004
    Inventor: Sung-Pei Hou
  • Patent number: 6716049
    Abstract: An IC socket (1) includes a base (10), a cover (11) pivotally mounted to one side of the base, and a plurality of electrical contacts received in the base for electrically connecting with a burn-in board. The base has six projecting members (102) to form a container for receiving an IC therein. The cover includes a frame (110) defining an opening (1101) a middle thereof, and a pressing portion (111). The pressing portion comprises a pair of bearing springs (1110), and a pair of bars (1111) interconnecting corresponding opposite ends of the bearing springs. The bars are embedded in the rear and front sides of the frame, and the bearing springs are located in opposite lateral sides of the opening. When the cover firmly engaging with the base, the bearing springs press the IC on the contacts. The IC socket thus electrically connects the IC with the burn-in board.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: April 6, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Andrew Gattuso, Sung-Pei Hou
  • Publication number: 20040005800
    Abstract: A socket connector (1) includes a base (10) defining an array of terminal cells (111), a number of conductive contacts (30) received in the respective terminal cells, a cover (20) slidably mounted on the base and a driving device (40) sandwiched between the cover and the base for driving the cover to move relative to the base. The cover has a supporting surface (211) for supporting a CPU (5) and defines an array of pin holes (213) corresponding to the terminal cells for insertion of pins (51) of the CPU therethrough. A standoff is formed on periphery edges of the supporting surface, and a number of small-dimensioned supporting posts (222) and large-dimensioned supporting posts (223) are formed on the supporting surface within the standoff for supporting the CPU mounted on the socket connector. The standoff and the supporting posts have the same height.
    Type: Application
    Filed: October 28, 2002
    Publication date: January 8, 2004
    Inventor: Sung-Pei Hou
  • Patent number: 6619974
    Abstract: A socket includes a base (10), a number of terminals (50) received in the base, a cover (10) movably mounted upon the base, an actuator (40) sandwiched between the cover and the base for driving the cover upon the base to move, and a guiding means (50). The guiding means includes a pair of columnar guiding posts (51, 51a, 51b 51c) and a pair of guiding holes (52, 52a, 52b, 52c) for receiving corresponding guiding posts. When the cover is in an open position, the guiding post is loosely received in the guiding hole and when the cover is in a close position, the guiding post is closely received in the guiding hole.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: September 16, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Sung-Pei Hou, Hsiang-Ping Chen
  • Patent number: 6561825
    Abstract: A vacuum pick up cap (10) for use with an electrical connector (20) includes a body portion (12) to be sucked by a vacuum suction nozzle and a number of legs (13) retained to the electrical connector. The body portion has an upper and a lower faces (120), (121) each having a central recess (122), and a number of peripheral recesses (123) surrounding the central recess, the recesses being spaced from each other. The body portion is substantially reduced in thickness due to the presence of the recesses.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: May 13, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Robert G. McHugh, Sung-Pei Hou
  • Patent number: 6558174
    Abstract: A pick-and-place device includes a substantially rigid board having a bottom face positionable and releasably attachable to a surface of a socket connector in which a plurality of passages are defined. The rigid board covers a first group of the passages with a second group of the passages not covered by the board. Openings are defined in the board to expose some of the passages of the first group for enhancing heat transfer. A solid portion of the rigid board forms a top face of the board for vacuum handling purposes. A flexibe, thin film has a first surface on which adhesive is coated for attaching the film to socket connector and covering both the passages of the second group and the exposed passages of the first group for shielding the passages against contaminants. The film partially overlaps and is adhesively attached to the top face of the board and has an opposite second surface exposed for vacuum handling of the socket connector.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: May 6, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Sung-Pei Hou
  • Patent number: 6547609
    Abstract: Disclosed is a vacuum pick up cap (10) for use in transporting by vacuum suction a socket (12) is provided. The socket includes a base (14) having an opening (20), and a cover (16) having a through-hole (22) and slidably stacked on an upper surface of the base to moveable between an open position and a closed position. The pick up cap has a flat surface and a leg (24). In the open position, the leg extends through the through-hole and into the opening. In the closed position, the leg is retained in the opening by a periphery of the through-hole.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: April 15, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: David G. Howell, Sung-Pei Hou
  • Patent number: 6533592
    Abstract: An electronic device includes an electrical connector (1) and an auxiliary cap (2) attached onto the connector. The cap has a smooth surface (21) to which a vacuum suction device may be applied to pick up the cap together with the connector. The connector includes an insulative member (10) and a number of contacts (100) retained in the insulative member. The insulative member defines a rectangular opening (121) at a center thereof. The cap has two latches (215, 216) downwardly extending to reside at positions substantially corresponding to and engaging two diagonal comers (128, 129) of the rectangular opening of the insulative thereby retaining the cap to the connector.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: March 18, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsiang-Ping Chen, Sung-Pei Hou
  • Patent number: 6519449
    Abstract: The invention provides a signal power control method and apparatus for a wireless system to control the power level of a received signal transmitted over a radio link so as to counteract transmission impairments caused by environment variations and maintain the reliability of the radio link. The signal power control of this invention serves to control the transmit power used for transmission and adjust the position of the receiver dynamic range so that the received signal can always be optimally received. In a preferred embodiment, the invention is incorporated in a broadband wireless access (BWA) time division multiplex access (TDMA) system to maintain the reliability of an upstream radio link connecting a base transceiver station (BTS) with multiple customer premises equipment (CPE) units.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: February 11, 2003
    Assignee: Nortel Networks Limited
    Inventors: Genzao G. Zhang, Kuang-Tsan Wu, Jiandong Zhuang, Pei Hou, Shiwei Gao, Harvey H. Lee
  • Publication number: 20030017725
    Abstract: Disclosed is a vacuum pick up cap (10) for use in transporting by vacuum suction a socket (12) is provided. The socket includes a base (14) having an opening (20), and a cover (16) having a through-hole (22) andslidably stacked on an upper surface of the base to moveable between an open position and a closed position. The pick up cap has a flat surface and a leg (24). In the open position, the leg extends through the through-hole and into the opening. In the closed position, the leg is retained in the opening by a periphery of the through-hole.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 23, 2003
    Inventors: David G. Howell, Sung-Pei Hou
  • Publication number: 20020157581
    Abstract: In a process for making a table panel, a looped peripheral frame confining a through-hole is formed in a first mold. The peripheral frame is placed in a second mold, and a bottom plate is formed in the through-hole such that a lateral end of the bottom plate extends along and is connected intimately to an inner wall of the peripheral frame. The peripheral frame and the bottom plate are placed in a third mold, and a transparent top plate is formed on the bottom plate in the through-hole. The top plate has a lateral end connected intimately to the inner wall of the peripheral frame.
    Type: Application
    Filed: April 25, 2001
    Publication date: October 31, 2002
    Inventor: Hsien-Pei Hou